| Translated title of the contribution | 混合細晶粒/奈米雙晶銅之耐蝕性應用於重分佈銅層 |
|---|---|
| Original language | English |
| Publication status | Accepted/In press/Filed - 7 Feb 2024 |
Ic Package With Nanotwinning-Assisted Structurally Stable Copper Structure
Shien Ping FENG (Inventor), Chih Chun CHUNG (Inventor), Sheng Jye CHERNG (Inventor), Kaiyu MU (Inventor)
Research output: Patents, Agreements and Assignments › RGC 51 - Patents (CityUHK)