Abstract
Physical mechanisms of hydrogen induced silicon surface layer cleavage were investigated using a combination of microscopy and spectroscopy techniques. The evolution of the silicon cleavage phenomenon is recorded by a series of microscopic images. The underlying hydrogen profiles under (between 250 and 500 °C) annealing are characterized by secondary-ion-mass spectroscopy and hydrogen forward scattering experiments. An idea gas law model calculation suggests that internal pressure of molecular hydrogen filled microcavities is in the range of Giga-Pascal, high enough to break silicon crystal bond. A dose threshold, which prevents cleavage, is observed at 1.6×1017 cm-2 for 40 kV hydrogen implantation. © 1997 American Institute of Physics.
| Original language | English |
|---|---|
| Pages (from-to) | 1804-1806 |
| Journal | Applied Physics Letters |
| Volume | 71 |
| Issue number | 13 |
| DOIs | |
| Publication status | Published - 29 Sept 1997 |
Fingerprint
Dive into the research topics of 'Hydrogen induced silicon surface layer cleavage'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver