Hybrid spectral/neural model based integrated control and supervision of a distributed thermal process in IC packaging

Research output: Journal Publications and ReviewsRGC 22 - Publication in policy or professional journal

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Author(s)

Detail(s)

Original languageEnglish
Pages (from-to)256-261
Journal / PublicationProceedings of the American Control Conference
Volume1
Publication statusPublished - 2005

Conference

Title2005 American Control Conference (ACC 2005)
PlaceUnited States
CityPortland
Period8 - 10 June 2005

Abstract

It is difficult to achieve optimal curing for die attachment in IC packaging due to the lack of tools for on-line measurement. In practice, the cure schedule is typically determined in a trial and error process even though it is costly and may not guarantee the reliability of the adhesive die attach. A novel spectral model based integration of cure schedule optimization, supervision and decoupling control is introduced to maintain both reliability and throughput. The method is straightforward and effective, and can be easily applied to the curing supervision in electronics industry. © 2005 AACC.