Hybrid spectral/neural model based integrated control and supervision of a distributed thermal process in IC packaging

Hua Deng; Han-Xiong Li

doi:10.1109/ACC.2005.1469942

Hybrid spectral/neural model based integrated control and supervision of a distributed thermal process in IC packaging

Hua Deng
, Han-Xiong Li

Research output: Journal Publications and Reviews › RGC 22 - Publication in policy or professional journal

Abstract

It is difficult to achieve optimal curing for die attachment in IC packaging due to the lack of tools for on-line measurement. In practice, the cure schedule is typically determined in a trial and error process even though it is costly and may not guarantee the reliability of the adhesive die attach. A novel spectral model based integration of cure schedule optimization, supervision and decoupling control is introduced to maintain both reliability and throughput. The method is straightforward and effective, and can be easily applied to the curing supervision in electronics industry. © 2005 AACC.

Original language	English
Pages (from-to)	256-261
Journal	Proceedings of the American Control Conference
Volume	1
DOIs	https://doi.org/10.1109/ACC.2005.1469942
Publication status	Published - 2005
Event	2005 American Control Conference (ACC 2005) - Portland, United States Duration: 8 Jun 2005 → 10 Jun 2005 https://ieeexplore.ieee.org/xpl/conhome/9861/proceeding

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SDG 9 Industry, Innovation, and Infrastructure

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title = "Hybrid spectral/neural model based integrated control and supervision of a distributed thermal process in IC packaging",

abstract = "It is difficult to achieve optimal curing for die attachment in IC packaging due to the lack of tools for on-line measurement. In practice, the cure schedule is typically determined in a trial and error process even though it is costly and may not guarantee the reliability of the adhesive die attach. A novel spectral model based integration of cure schedule optimization, supervision and decoupling control is introduced to maintain both reliability and throughput. The method is straightforward and effective, and can be easily applied to the curing supervision in electronics industry. {\textcopyright} 2005 AACC.",

author = "Hua Deng and Han-Xiong Li",

year = "2005",

doi = "10.1109/ACC.2005.1469942",

language = "English",

volume = "1",

pages = "256--261",

journal = "Proceedings of the American Control Conference",

issn = "0743-1619",

publisher = "IEEE",

note = "2005 American Control Conference (ACC 2005) ; Conference date: 08-06-2005 Through 10-06-2005",

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AU - Deng, Hua

AU - Li, Han-Xiong

PY - 2005

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N2 - It is difficult to achieve optimal curing for die attachment in IC packaging due to the lack of tools for on-line measurement. In practice, the cure schedule is typically determined in a trial and error process even though it is costly and may not guarantee the reliability of the adhesive die attach. A novel spectral model based integration of cure schedule optimization, supervision and decoupling control is introduced to maintain both reliability and throughput. The method is straightforward and effective, and can be easily applied to the curing supervision in electronics industry. © 2005 AACC.

AB - It is difficult to achieve optimal curing for die attachment in IC packaging due to the lack of tools for on-line measurement. In practice, the cure schedule is typically determined in a trial and error process even though it is costly and may not guarantee the reliability of the adhesive die attach. A novel spectral model based integration of cure schedule optimization, supervision and decoupling control is introduced to maintain both reliability and throughput. The method is straightforward and effective, and can be easily applied to the curing supervision in electronics industry. © 2005 AACC.

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U2 - 10.1109/ACC.2005.1469942

DO - 10.1109/ACC.2005.1469942

M3 - RGC 22 - Publication in policy or professional journal

SN - 0743-1619

VL - 1

SP - 256

EP - 261

JO - Proceedings of the American Control Conference

JF - Proceedings of the American Control Conference

T2 - 2005 American Control Conference (ACC 2005)

Y2 - 8 June 2005 through 10 June 2005

ER -

Hybrid spectral/neural model based integrated control and supervision of a distributed thermal process in IC packaging

Abstract

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