High-entropy alloy (HEA) nanolattice composites and their mechanical properties

Research output: Conference Papers (RGC: 31A, 31B, 32, 33)32_Refereed conference paper (no ISBN/ISSN)

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Detail(s)

Original languageEnglish
Pages10
Publication statusPublished - 27 Jun 2017

Conference

TitleThe 21st Annual Conference of HKSTAM 2017 in conjunction with the 13th Jiangsu - Hong Kong Forum on Mechanics and Its Application
LocationThe Hong Kong Polytechnic University, Hong Kong SAR
PlaceHong Kong
Period8 April 2017

Abstract

Ordered Micro/nano lattice is of great intensive interest recently because of its tremendously potential application in photovoltaic gadgets, hierarchical structure materials and scaffold for cell cultivation as well as drug delivery based on its unique and superior mechanical property compared to stochastic foams, in terms of the high strength and fracture toughness deduced from its synergetic coupling
effect of the geometry structural with functional constituent materials. Herein, we report the fabrication, characterization and mechanical properties of periodically arranged HEA (CoCrFeNiAl0.3)-polymer nanolattice composite with the dimensions of individual components spanning from nanometers to tens of micrometers for the first time via two-photon lithography. More importantly, to the best of our knowledge, the CoCrFeNiAl0.3 HEA film fabricated via this novel radio frequency (RF) magnetron sputtering methodology has not been reported yet. Additionally, the compression strength (σf) and the Young’s modulus (E) of the nanolattice composite is remarkably 2.5 and 4 times higher than that of the pure polymer nanolattice, respectively

Citation Format(s)

High-entropy alloy (HEA) nanolattice composites and their mechanical properties. / GAO, Libo; LI, Junyang; SUN, Dong; LU, Yang.

2017. 10 Paper presented at The 21st Annual Conference of HKSTAM 2017 in conjunction with the 13th Jiangsu - Hong Kong Forum on Mechanics and Its Application, Hong Kong.

Research output: Conference Papers (RGC: 31A, 31B, 32, 33)32_Refereed conference paper (no ISBN/ISSN)