High-temperature “Inverse” Hall-Petch relationship and fracture behavior of TA15 alloy

Shaolong Li, Shufeng Li*, Lei Liu, Huiying Liu, Chuanyun Wang, Philip J. Withers*, Yuntian Zhu*, Lina Gao, Shaodi Wang, Biao Chen, Wangtu Huo, Jianbo Gao, Xin Zhang, Bo Li

*Corresponding author for this work

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

28 Citations (Scopus)

Abstract

The Hall-Petch relationship is important for material design at room temperature. However, it is not well studied at high temperatures. In this work, the influence of different microstructures on the high-temperature mechanical behavior and corresponding softening mechanisms of high-temperature titanium alloy TA15 (Ti-6.5Al-2Zr-1Mo-1 V, wt.%) were studied. Specimens with duplex, Widmanstätten, and coarse Widmanstätten microstructures were obtained through powder metallurgy. High-temperature tensile tests were carried out between 500 and 650°C. It was found that the fracture mode of the Widmanstätten microstructure was transgranular at 500 °C and 550 °C, but intergranular at 600 °C and 650 °C. EBSD analysis revealed that the high-temperature deformation was facilitated by several mechanisms including GB softening, GB migration, grains rotation, and activation of multiple slip systems. High temperature nanoindentation indicated sofenting of individual grains with increasing temperature. In-situ tensile testing under SEM revealed deformation was primarily in grain interior at room temperature, and GBs played a significant role at 650℃. The GB behavior at high temperatures is believed responsible for the inverse Hall-Petch relationship. These findings provide a new perspective for improving the high-temperature mechanical properties and microstructure control of titanium and its alloys. © 2024 Elsevier Ltd.
Original languageEnglish
Article number103951
JournalInternational Journal of Plasticity
Volume176
Online published28 Mar 2024
DOIs
Publication statusPublished - May 2024

Funding

This work was supported by the National Key R&D Program of China (2021YFB3701203), the National Natural Science Foundation of China ( 52201165 ), the Shaanxi Innovative Research Team for Key Science and Technology (2023-CX-TD-46), and the Doctoral Study Abroad Joint Education Fund of Xi'an University of Technology (101/252092301). P.J.W acknowledges support from the Henry Royce Institute, initiated through EPSRC (EP/R00661X/1, EP/S019367/1, EP/P025021/1, and EP/P025498/1.). Y. Zhu acknowledges supports from the National Natural Science Foundation of China ( 11988103 ) and the Hong Kong Research Grants Council (GRF 11214121 ).

Research Keywords

  • Grain-boundary strength
  • High-temperature softening mechanism
  • High-temperature “Inverse” Hall-Petch
  • TA15 alloy

Publisher's Copyright Statement

  • COPYRIGHT TERMS OF DEPOSITED POSTPRINT FILE: © 2024 Elsevier. This manuscript version is made available under the CC-BY-NC-ND 4.0 license https://creativecommons.org/licenses/by-nc-nd/4.0/.

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