High strength and deformation mechanisms of Al0.3 CoCrFeNi high-entropy alloy thin films fabricated by magnetron sputtering

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Author(s)

  • Wei-Bing Liao
  • Hongti Zhang
  • Zhi-Yuan Liu
  • Pei-Feng Li
  • Jian-Jun Huang
  • And 2 others
  • Chun-Yan Yu
  • Yang Lu

Detail(s)

Original languageEnglish
Article number146
Journal / PublicationEntropy
Volume21
Issue number2
Online published4 Feb 2019
Publication statusPublished - Feb 2019

Link(s)

Abstract

Recently, high-entropy alloy thin films (HEATFs) with nanocrystalline structures and high hardness were developed by magnetron sputtering technique and have exciting potential to make small structure devices and precision instruments with sizes ranging from nanometers to micrometers. However, the strength and deformation mechanisms are still unclear. In this work, nanocrystalline Al0.3 CoCrFeNi HEATFs with a thickness of ~4 μm were prepared. The microstructures of the thin films were comprehensively characterized, and the mechanical properties were systematically studied. It was found that the thin film was smooth, with a roughness of less than 5 nm. The chemical composition of the high entropy alloy thin film was homogeneous with a main single face-centered cubic (FCC) structure. Furthermore, it was observed that the hardness and the yield strength of the high-entropy alloy thin film was about three times that of the bulk samples, and the plastic deformation was inhomogeneous. Our results could provide an in-depth understanding of the mechanics and deformation mechanism for future design of nanocrystalline HEATFs with desired properties.

Research Area(s)

  • Deformation behaviors, Hardness, High-entropy alloys, Nanocrystalline, Thin films

Citation Format(s)

High strength and deformation mechanisms of Al0.3 CoCrFeNi high-entropy alloy thin films fabricated by magnetron sputtering. / Liao, Wei-Bing; Zhang, Hongti; Liu, Zhi-Yuan et al.

In: Entropy, Vol. 21, No. 2, 146, 02.2019.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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