TY - GEN
T1 - High-efficiency millimeter-wave substrate integrated waveguide silicon on-chip antennas using through silicon via
AU - Guo, Yong-Xin
AU - Chu, Hui
N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].
PY - 2010
Y1 - 2010
N2 - In this paper, the through silicon via (TSV) technology is employed to design millimeter-wave substrate integrated waveguide (SIW) based on-chip antennas. The TSV based SIW is first characterized with different silicon resistivity, substrate thickness and via pitch size. Then a high-efficiency TSV based SIW antenna is demonstrated. © 2010 IEEE.
AB - In this paper, the through silicon via (TSV) technology is employed to design millimeter-wave substrate integrated waveguide (SIW) based on-chip antennas. The TSV based SIW is first characterized with different silicon resistivity, substrate thickness and via pitch size. Then a high-efficiency TSV based SIW antenna is demonstrated. © 2010 IEEE.
UR - https://www.scopus.com/pages/publications/78650052760
UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-78650052760&origin=recordpage
U2 - 10.1109/ICUWB.2010.5615804
DO - 10.1109/ICUWB.2010.5615804
M3 - RGC 32 - Refereed conference paper (with host publication)
SN - 9781424453061
VL - 1
T3 - 2010 IEEE International Conference on Ultra-Wideband, ICUWB2010 - Proceedings
SP - 34
EP - 37
BT - 2010 IEEE International Conference on Ultra-Wideband, ICUWB2010 - Proceedings
T2 - 2010 IEEE International Conference on Ultra-Wideband, ICUWB2010
Y2 - 20 September 2010 through 23 September 2010
ER -