TY - JOUR
T1 - Hierarchical silicon nanostructured arrays via metal-assisted chemical etching
AU - Lin, Hao
AU - Fang, Ming
AU - Cheung, Ho-Yuen
AU - Xiu, Fei
AU - Yip, Sen Po
AU - Wong, Chun-Yuen
AU - Ho, Johnny C.
PY - 2014
Y1 - 2014
N2 - Hierarchically arranged nanostructures, configured in both nanopillars and nanoholes, have been fabricated via a low-cost approach that combines metal-assisted chemical etching (MaCE), nanosphere lithography and conventional photolithography. By manipulating the catalyst morphology as well as the deposition method, different interesting nanostructures like nanowalls and nanograsses were fabricated at the galleries among the nanopillar blocks. Using a similar strategy, hierarchical negative structures (nanoholes) have also been successfully demonstrated. The successful construction of these diversified hierarchical nanostructures illustrates that MaCE could be employed as a feasible, low-cost method for multi-scale silicon micro/nano machining, which is highly desirable for widespread applications, including tissue engineering, optoelectronics, photonic devices and lab-on-chip systems.
AB - Hierarchically arranged nanostructures, configured in both nanopillars and nanoholes, have been fabricated via a low-cost approach that combines metal-assisted chemical etching (MaCE), nanosphere lithography and conventional photolithography. By manipulating the catalyst morphology as well as the deposition method, different interesting nanostructures like nanowalls and nanograsses were fabricated at the galleries among the nanopillar blocks. Using a similar strategy, hierarchical negative structures (nanoholes) have also been successfully demonstrated. The successful construction of these diversified hierarchical nanostructures illustrates that MaCE could be employed as a feasible, low-cost method for multi-scale silicon micro/nano machining, which is highly desirable for widespread applications, including tissue engineering, optoelectronics, photonic devices and lab-on-chip systems.
UR - http://www.scopus.com/inward/record.url?scp=84907991462&partnerID=8YFLogxK
UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-84907991462&origin=recordpage
U2 - 10.1039/c4ra06172a
DO - 10.1039/c4ra06172a
M3 - RGC 21 - Publication in refereed journal
SN - 2046-2069
VL - 4
SP - 50081
EP - 50085
JO - RSC Advances
JF - RSC Advances
IS - 91
ER -