Heterostructure induced dispersive shear bands in heterostructured Cu

Y.F. Wang; C.X. Huang; Q. He; F.J. Guo; M.S. Wang; L.Y. Song; Y.T. Zhu

doi:10.1016/j.scriptamat.2019.05.036

Heterostructure induced dispersive shear bands in heterostructured Cu

Y.F. Wang
, C.X. Huang^*
, Q. He
, F.J. Guo
, M.S. Wang
, L.Y. Song
, Y.T. Zhu^*

^*Corresponding author for this work

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

102 Citations (Scopus)

Abstract

Here we report the formation of dispersive shear bands in a heterostructured Cu composed of coarse-grained (CG) and ultrafine-grained (UFG) domains. Microscale digital image correlation revealed that dense shear bands evolved in a stable manner over the whole gauge section. Our observation suggests that the limited strain hardening of UFG domains and deformation heterogeneity promoted shear banding, which is a major deformation mechanism in heterostructured materials. The dispersive shear banding helped with ductility retention.

Original language	English
Pages (from-to)	76-80
Journal	Scripta Materialia
Volume	170
Online published	4 Jun 2019
DOIs	https://doi.org/10.1016/j.scriptamat.2019.05.036
Publication status	Published - Sept 2019
Externally published	Yes

Research Keywords

Ductility
Heterostructure
Heterostructured domain boundary
Microscale DIC
Shear banding

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10.1016/j.scriptamat.2019.05.036

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title = "Heterostructure induced dispersive shear bands in heterostructured Cu",

abstract = "Here we report the formation of dispersive shear bands in a heterostructured Cu composed of coarse-grained (CG) and ultrafine-grained (UFG) domains. Microscale digital image correlation revealed that dense shear bands evolved in a stable manner over the whole gauge section. Our observation suggests that the limited strain hardening of UFG domains and deformation heterogeneity promoted shear banding, which is a major deformation mechanism in heterostructured materials. The dispersive shear banding helped with ductility retention.",

keywords = "Ductility, Heterostructure, Heterostructured domain boundary, Microscale DIC, Shear banding, Ductility, Heterostructure, Heterostructured domain boundary, Microscale DIC, Shear banding, Ductility, Heterostructure, Heterostructured domain boundary, Microscale DIC, Shear banding",

author = "Y.F. Wang and C.X. Huang and Q. He and F.J. Guo and M.S. Wang and L.Y. Song and Y.T. Zhu",

year = "2019",

month = sep,

doi = "10.1016/j.scriptamat.2019.05.036",

language = "English",

volume = "170",

pages = "76--80",

journal = "Scripta Materialia",

issn = "1359-6462",

publisher = "Acta Materialia Inc",

}

TY - JOUR

T1 - Heterostructure induced dispersive shear bands in heterostructured Cu

AU - Wang, Y.F.

AU - Huang, C.X.

AU - He, Q.

AU - Guo, F.J.

AU - Wang, M.S.

AU - Song, L.Y.

AU - Zhu, Y.T.

PY - 2019/9

Y1 - 2019/9

N2 - Here we report the formation of dispersive shear bands in a heterostructured Cu composed of coarse-grained (CG) and ultrafine-grained (UFG) domains. Microscale digital image correlation revealed that dense shear bands evolved in a stable manner over the whole gauge section. Our observation suggests that the limited strain hardening of UFG domains and deformation heterogeneity promoted shear banding, which is a major deformation mechanism in heterostructured materials. The dispersive shear banding helped with ductility retention.

AB - Here we report the formation of dispersive shear bands in a heterostructured Cu composed of coarse-grained (CG) and ultrafine-grained (UFG) domains. Microscale digital image correlation revealed that dense shear bands evolved in a stable manner over the whole gauge section. Our observation suggests that the limited strain hardening of UFG domains and deformation heterogeneity promoted shear banding, which is a major deformation mechanism in heterostructured materials. The dispersive shear banding helped with ductility retention.

KW - Ductility

KW - Heterostructure

KW - Heterostructured domain boundary

KW - Microscale DIC

KW - Shear banding

KW - Ductility

KW - Heterostructure

KW - Heterostructured domain boundary

KW - Microscale DIC

KW - Shear banding

KW - Ductility

KW - Heterostructure

KW - Heterostructured domain boundary

KW - Microscale DIC

KW - Shear banding

UR - https://www.scopus.com/pages/publications/85066493928

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-85066493928&origin=recordpage

U2 - 10.1016/j.scriptamat.2019.05.036

DO - 10.1016/j.scriptamat.2019.05.036

M3 - RGC 21 - Publication in refereed journal

SN - 1359-6462

VL - 170

SP - 76

EP - 80

JO - Scripta Materialia

JF - Scripta Materialia

ER -

Heterostructure induced dispersive shear bands in heterostructured Cu

Abstract

Research Keywords

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