Hardening mechanisms of nanocrystalline Ti-Al-N solid solution films
Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Author(s)
Detail(s)
| Original language | English |
|---|---|
| Pages (from-to) | 161-166 |
| Journal / Publication | Thin Solid Films |
| Volume | 468 |
| Issue number | 1-2 |
| Publication status | Published - 1 Dec 2004 |
Link(s)
Abstract
Nanocrystalline Ti1-xAlxN (0≤x≤0.41) solid solution films were produced by reactive unbalanced close-field magnetron sputtering. Nanoindentation measurements showed that the hardness of Ti 1-xAlxN films increased monotonously with the content of Al. A calculation based on a semiempirical method revealed that the effect of intrinsic hardening, which arises from the change of the nature of atomic bonding due to the incorporation of Al atoms into TiN lattice, played a negligible role in the observed hardening phenomena. Further analysis revealed that the grain boundary hardening was also very weak and the improvement of hardness of Ti1-xAlxN films with relatively low content of Al (x≤0.33) could be well explained by the Fleischer model of solid solution hardening. However, for Ti1-xAlxN films with x
Research Area(s)
- Hardening mechanisms, Sputtering, Titanium aluminum nitride
Citation Format(s)
Hardening mechanisms of nanocrystalline Ti-Al-N solid solution films. / Liu, Z. J.; Shum, P. W.; Shen, Y. G.
In: Thin Solid Films, Vol. 468, No. 1-2, 01.12.2004, p. 161-166.Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
