Hard nanocomposite Ti-Si-N films prepared by DC reactive magnetron sputtering using Ti-Si mosaic target

Ye Xu; Liuhe Li; Xun Cai; Paul K. Chu

doi:10.1016/j.surfcoat.2006.09.078

Hard nanocomposite Ti-Si-N films prepared by DC reactive magnetron sputtering using Ti-Si mosaic target

Ye Xu, Liuhe Li, Xun Cai, Paul K. Chu

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

24 Citations (Scopus)

Abstract

Hard nanocomposite Ti-Si-N films were deposited on 321 stainless steel substrates by direct current (DC) reactive magnetron sputtering using a Ti-Si mosaic target consisting of a Ti plate and Si chips. The composition, microstructure, and mechanical properties were investigated using EDX, XRD, XPS, nano-indentation, and scratch tests. The results indicate that the hardness of the Ti-Si-N film gradually rises with increasing Si contents in the layer until the peak value of 42 GPa appears corresponding to a Si content of 11.2 at.%. The hardness then decreases with further increase in the Si content. XRD and XPS reveal that the hardest Ti-Si-N film consists of fine TiN crystallites (approximately 8 nm in size) in an amorphous Si₃N₄ matrix. Preferential growth of TiN is indicated by the XRD patterns. All the Ti-Si-N films show high adhesive strength as indicated by the scratch tests. The strengthening mechanism of the nanocomposite films is also discussed. © 2006 Elsevier B.V. All rights reserved.

Original language	English
Pages (from-to)	6824-6827
Journal	Surface and Coatings Technology
Volume	201
Issue number	15
DOIs	https://doi.org/10.1016/j.surfcoat.2006.09.078
Publication status	Published - 23 Apr 2007

Research Keywords

Adhesive strength
Microstructure
Nanohardness
Ti-Si-N nanocomposite film

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title = "Hard nanocomposite Ti-Si-N films prepared by DC reactive magnetron sputtering using Ti-Si mosaic target",

abstract = "Hard nanocomposite Ti-Si-N films were deposited on 321 stainless steel substrates by direct current (DC) reactive magnetron sputtering using a Ti-Si mosaic target consisting of a Ti plate and Si chips. The composition, microstructure, and mechanical properties were investigated using EDX, XRD, XPS, nano-indentation, and scratch tests. The results indicate that the hardness of the Ti-Si-N film gradually rises with increasing Si contents in the layer until the peak value of 42 GPa appears corresponding to a Si content of 11.2 at.%. The hardness then decreases with further increase in the Si content. XRD and XPS reveal that the hardest Ti-Si-N film consists of fine TiN crystallites (approximately 8 nm in size) in an amorphous Si3N4 matrix. Preferential growth of TiN is indicated by the XRD patterns. All the Ti-Si-N films show high adhesive strength as indicated by the scratch tests. The strengthening mechanism of the nanocomposite films is also discussed. {\textcopyright} 2006 Elsevier B.V. All rights reserved.",

keywords = "Adhesive strength, Microstructure, Nanohardness, Ti-Si-N nanocomposite film",

author = "Ye Xu and Liuhe Li and Xun Cai and Chu, {Paul K.}",

year = "2007",

month = apr,

day = "23",

doi = "10.1016/j.surfcoat.2006.09.078",

language = "English",

volume = "201",

pages = "6824--6827",

journal = "Surface and Coatings Technology",

issn = "0257-8972",

publisher = "Elsevier B.V.",

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}

TY - JOUR

T1 - Hard nanocomposite Ti-Si-N films prepared by DC reactive magnetron sputtering using Ti-Si mosaic target

AU - Xu, Ye

AU - Li, Liuhe

AU - Cai, Xun

AU - Chu, Paul K.

PY - 2007/4/23

Y1 - 2007/4/23

N2 - Hard nanocomposite Ti-Si-N films were deposited on 321 stainless steel substrates by direct current (DC) reactive magnetron sputtering using a Ti-Si mosaic target consisting of a Ti plate and Si chips. The composition, microstructure, and mechanical properties were investigated using EDX, XRD, XPS, nano-indentation, and scratch tests. The results indicate that the hardness of the Ti-Si-N film gradually rises with increasing Si contents in the layer until the peak value of 42 GPa appears corresponding to a Si content of 11.2 at.%. The hardness then decreases with further increase in the Si content. XRD and XPS reveal that the hardest Ti-Si-N film consists of fine TiN crystallites (approximately 8 nm in size) in an amorphous Si3N4 matrix. Preferential growth of TiN is indicated by the XRD patterns. All the Ti-Si-N films show high adhesive strength as indicated by the scratch tests. The strengthening mechanism of the nanocomposite films is also discussed. © 2006 Elsevier B.V. All rights reserved.

AB - Hard nanocomposite Ti-Si-N films were deposited on 321 stainless steel substrates by direct current (DC) reactive magnetron sputtering using a Ti-Si mosaic target consisting of a Ti plate and Si chips. The composition, microstructure, and mechanical properties were investigated using EDX, XRD, XPS, nano-indentation, and scratch tests. The results indicate that the hardness of the Ti-Si-N film gradually rises with increasing Si contents in the layer until the peak value of 42 GPa appears corresponding to a Si content of 11.2 at.%. The hardness then decreases with further increase in the Si content. XRD and XPS reveal that the hardest Ti-Si-N film consists of fine TiN crystallites (approximately 8 nm in size) in an amorphous Si3N4 matrix. Preferential growth of TiN is indicated by the XRD patterns. All the Ti-Si-N films show high adhesive strength as indicated by the scratch tests. The strengthening mechanism of the nanocomposite films is also discussed. © 2006 Elsevier B.V. All rights reserved.

KW - Adhesive strength

KW - Microstructure

KW - Nanohardness

KW - Ti-Si-N nanocomposite film

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U2 - 10.1016/j.surfcoat.2006.09.078

DO - 10.1016/j.surfcoat.2006.09.078

M3 - RGC 21 - Publication in refereed journal

SN - 0257-8972

VL - 201

SP - 6824

EP - 6827

JO - Surface and Coatings Technology

JF - Surface and Coatings Technology

IS - 15

ER -

Hard nanocomposite Ti-Si-N films prepared by DC reactive magnetron sputtering using Ti-Si mosaic target

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Research Keywords

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