Half-transient liquid phase diffusion welding : An approach for diffusion welding of SiCp/A356 with Cu interlayer

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Author(s)

  • Meng Hua
  • Wei Guo
  • Hang Wai Law
  • John Kin Lim Ho

Detail(s)

Original languageEnglish
Pages (from-to)504-512
Journal / PublicationInternational Journal of Advanced Manufacturing Technology
Volume37
Issue number5-6
Publication statusPublished - May 2008

Abstract

Aluminum matrix composite SiCp/A356 was welded by half-transient liquid Phase diffusion welding (HTLPDW) with a Cu interlayer. The effects of welding parameters and interlayer thickness on the properties of the welded joint were investigated, and the optimal welding parameters were subsequently put forward. The relationship between the tensile strength of the joint and the microstructure was studied by analyzing the microstructure of joint using a scanning electron microscope (SEM) and an electron probe micro-analysis (EPMA). Results confirmed the success of welding aluminum matrix composite SiC p/A356 utilizing HTLPDW method with a Cu interlayer. Shorter welding time was a prominent characteristic of HTLPDW as compared with conventional transient liquid phase (TLP) diffusion welding. Furthermore, its welded joints had a tensile strength almost 72% of its parent matrix composites, evidently signifying the suitable application of half-transient liquid phase diffusion welding in welding composite engineering structures. © 2007 Springer-Verlag London Limited.

Research Area(s)

  • Aluminum matrix composite, Cu interlayer, Half-transient liquid phase diffusion welding, SiCp/A356

Citation Format(s)

Half-transient liquid phase diffusion welding : An approach for diffusion welding of SiCp/A356 with Cu interlayer. / Hua, Meng; Guo, Wei; Law, Hang Wai; Ho, John Kin Lim.

In: International Journal of Advanced Manufacturing Technology, Vol. 37, No. 5-6, 05.2008, p. 504-512.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review