Half-transient liquid phase diffusion welding: An approach for diffusion welding of SiCp/A356 with Cu interlayer

Meng Hua, Wei Guo, Hang Wai Law, John Kin Lim Ho

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    10 Citations (Scopus)

    Abstract

    Aluminum matrix composite SiCp/A356 was welded by half-transient liquid Phase diffusion welding (HTLPDW) with a Cu interlayer. The effects of welding parameters and interlayer thickness on the properties of the welded joint were investigated, and the optimal welding parameters were subsequently put forward. The relationship between the tensile strength of the joint and the microstructure was studied by analyzing the microstructure of joint using a scanning electron microscope (SEM) and an electron probe micro-analysis (EPMA). Results confirmed the success of welding aluminum matrix composite SiC p/A356 utilizing HTLPDW method with a Cu interlayer. Shorter welding time was a prominent characteristic of HTLPDW as compared with conventional transient liquid phase (TLP) diffusion welding. Furthermore, its welded joints had a tensile strength almost 72% of its parent matrix composites, evidently signifying the suitable application of half-transient liquid phase diffusion welding in welding composite engineering structures. © 2007 Springer-Verlag London Limited.
    Original languageEnglish
    Pages (from-to)504-512
    JournalInternational Journal of Advanced Manufacturing Technology
    Volume37
    Issue number5-6
    DOIs
    Publication statusPublished - May 2008

    Research Keywords

    • Aluminum matrix composite
    • Cu interlayer
    • Half-transient liquid phase diffusion welding
    • SiCp/A356

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