Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction

J. Shen; Y. C. Chan; S. Y. Liu

doi:10.1016/j.actamat.2009.07.021

Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction

J. Shen
, Y. C. Chan
, S. Y. Liu

Department of Electrical Engineering

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

134 Citations (Scopus)

Abstract

The chemical interfacial reaction of Ni plates with eutectic Sn-3.5Ag lead-free solder was studied by microstructural observations and mathematical calculations. Compared with the Sn-3.5Ag-0.75Ni/Ni interfacial reaction, based on a simple model of the growth of the liquid/solid chemical compound layer, the growth mechanism of Ni₃Sn₄ in the Sn-3.5Ag/Ni interfacial reaction is discussed and presented. The growth process of Ni₃Sn₄ in the Sn/Ni liquid/solid reaction interface involves the net effect of several interrelated phenomena, such as volume diffusion, grain boundary diffusion, grain boundary grooving, grain coarsening, and dissolution into the molten solder. The growth time exponent n and morphology of Ni₃Sn₄ were found to be dependent on these factors. © 2009 Acta Materialia Inc.

Original language	English
Pages (from-to)	5196-5206
Journal	Acta Materialia
Volume	57
Issue number	17
DOIs	https://doi.org/10.1016/j.actamat.2009.07.021
Publication status	Published - Oct 2009

Research Keywords

Growth mechanism
Interfacial reaction
Microstructure
Sn/Ni

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10.1016/j.actamat.2009.07.021

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title = "Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction",

abstract = "The chemical interfacial reaction of Ni plates with eutectic Sn-3.5Ag lead-free solder was studied by microstructural observations and mathematical calculations. Compared with the Sn-3.5Ag-0.75Ni/Ni interfacial reaction, based on a simple model of the growth of the liquid/solid chemical compound layer, the growth mechanism of Ni3Sn4 in the Sn-3.5Ag/Ni interfacial reaction is discussed and presented. The growth process of Ni3Sn4 in the Sn/Ni liquid/solid reaction interface involves the net effect of several interrelated phenomena, such as volume diffusion, grain boundary diffusion, grain boundary grooving, grain coarsening, and dissolution into the molten solder. The growth time exponent n and morphology of Ni3Sn4 were found to be dependent on these factors. {\textcopyright} 2009 Acta Materialia Inc.",

keywords = "Growth mechanism, Interfacial reaction, Microstructure, Sn/Ni",

author = "J. Shen and Chan, \{Y. C.\} and Liu, \{S. Y.\}",

year = "2009",

month = oct,

doi = "10.1016/j.actamat.2009.07.021",

language = "English",

volume = "57",

pages = "5196--5206",

journal = "Acta Materialia",

issn = "1359-6454",

publisher = "Elsevier Ltd.",

number = "17",

}

TY - JOUR

T1 - Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction

AU - Shen, J.

AU - Chan, Y. C.

AU - Liu, S. Y.

PY - 2009/10

Y1 - 2009/10

N2 - The chemical interfacial reaction of Ni plates with eutectic Sn-3.5Ag lead-free solder was studied by microstructural observations and mathematical calculations. Compared with the Sn-3.5Ag-0.75Ni/Ni interfacial reaction, based on a simple model of the growth of the liquid/solid chemical compound layer, the growth mechanism of Ni3Sn4 in the Sn-3.5Ag/Ni interfacial reaction is discussed and presented. The growth process of Ni3Sn4 in the Sn/Ni liquid/solid reaction interface involves the net effect of several interrelated phenomena, such as volume diffusion, grain boundary diffusion, grain boundary grooving, grain coarsening, and dissolution into the molten solder. The growth time exponent n and morphology of Ni3Sn4 were found to be dependent on these factors. © 2009 Acta Materialia Inc.

AB - The chemical interfacial reaction of Ni plates with eutectic Sn-3.5Ag lead-free solder was studied by microstructural observations and mathematical calculations. Compared with the Sn-3.5Ag-0.75Ni/Ni interfacial reaction, based on a simple model of the growth of the liquid/solid chemical compound layer, the growth mechanism of Ni3Sn4 in the Sn-3.5Ag/Ni interfacial reaction is discussed and presented. The growth process of Ni3Sn4 in the Sn/Ni liquid/solid reaction interface involves the net effect of several interrelated phenomena, such as volume diffusion, grain boundary diffusion, grain boundary grooving, grain coarsening, and dissolution into the molten solder. The growth time exponent n and morphology of Ni3Sn4 were found to be dependent on these factors. © 2009 Acta Materialia Inc.

KW - Growth mechanism

KW - Interfacial reaction

KW - Microstructure

KW - Sn/Ni

UR - https://www.scopus.com/pages/publications/69949125659

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-69949125659&origin=recordpage

U2 - 10.1016/j.actamat.2009.07.021

DO - 10.1016/j.actamat.2009.07.021

M3 - RGC 21 - Publication in refereed journal

SN - 1359-6454

VL - 57

SP - 5196

EP - 5206

JO - Acta Materialia

JF - Acta Materialia

IS - 17

ER -

Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction

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