Growth mechanism of an aluminium-induced solid phase epitaxial (AI-SPE) Si0.5Ge0.5 layer using : In situ heating transmission electron microscopy
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Author(s)
Detail(s)
Original language | English |
---|---|
Pages (from-to) | 3556-3560 |
Journal / Publication | CrystEngComm |
Volume | 18 |
Issue number | 20 |
Online published | 19 Apr 2016 |
Publication status | Published - 28 May 2016 |
Externally published | Yes |
Link(s)
Abstract
The mechanism of growth of an epitaxial Si0.5Ge0.5 layer on a single crystalline (sc) Si (100) substrate by aluminum-induced solid phase epitaxy (AI-SPE) at a relatively low temperature (450 °C) has been revealed using in situ heating transmission electron microscopy (TEM). The analysis of the thermodynamics exactly supports the finding from in situ TEM. It evidences that the Si0.5Ge0.5 prefers to nucleate at the interface of the Al layer and the sc-Si (100) substrate due to the lowest critical thickness for nucleation. Based on the results from in situ TEM and thermodynamic analysis, the germanium (Ge) virtual substrate of the compositional gradient can be successfully prepared via a multi-run AI-SPE process at low-temperature.
Citation Format(s)
Growth mechanism of an aluminium-induced solid phase epitaxial (AI-SPE) Si0.5Ge0.5 layer using: In situ heating transmission electron microscopy. / Lin, Chuan-Jung; Hsu, Chien-Chung; Yu, Sheng-Min et al.
In: CrystEngComm, Vol. 18, No. 20, 28.05.2016, p. 3556-3560.
In: CrystEngComm, Vol. 18, No. 20, 28.05.2016, p. 3556-3560.
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review