Growth characteristic study of intermetallic compounds growth in nanoscale-thickness Cu/Sn/Cu sandwich structure

Qingqian Li; Y. C. Chan; Shafiq Ismathullakhan

doi:10.1109/EPTC.2011.6184433

Growth characteristic study of intermetallic compounds growth in nanoscale-thickness Cu/Sn/Cu sandwich structure

Qingqian Li
, Y. C. Chan^*
, Shafiq Ismathullakhan

^*Corresponding author for this work

Department of Electrical Engineering

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

4 Citations (Scopus)

Abstract

The formation and growth characteristics of intermetallic compounds (IMC) at the interfaces in nanoscale and microscale thickness Cu-Sn-Cu sandwich structure (with different solder layer thicknesses of 130nm, 400nm and 1.5μm) during reflow soldering and aging were studied. The sandwich structure samples were fabricated by electro-plating, and followed by reflow and aging process. It was found that solder layers (Sn layers) might be totally consumed in the soldering and aging process when the thickness is sub-micron. For samples with solder layers of 130nm, we could even hardly find any evidence of the existence of Cu ₆Sn ₅ in the assoldered samples. For samples with solder layers of 400nm, both Cu ₆Sn ₅ phase and Cu ₃Sn phase were detected in the assoldered samples, and Sn as well as Cu ₆Sn ₅ was consumed in the aging period. When solder layer reached 1.5μm, Cu ₃Sn nucleated during aging but not the reflow process. Yet the overall thickness of IMC growth of these samples could not be described by the reported empirical parabolic curve of binary Cu-Sn couple's IMC growth, since the sub-micron solder layer was totally consumed by the growth of IMCs. © 2011 IEEE.

Original language	English
Title of host publication	2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
Pages	289-293
DOIs	https://doi.org/10.1109/EPTC.2011.6184433
Publication status	Published - 2011
Event	13th Electronics Packaging Technology Conference (EPTC 2011) - Shangri-La Hotel, Singapore Duration: 7 Dec 2011 → 9 Dec 2011

Conference

Conference	13th Electronics Packaging Technology Conference (EPTC 2011)
Place	Singapore
Period	7/12/11 → 9/12/11

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@inproceedings{8ee8db925e234361a1c206aac520fb97,

title = "Growth characteristic study of intermetallic compounds growth in nanoscale-thickness Cu/Sn/Cu sandwich structure",

abstract = "The formation and growth characteristics of intermetallic compounds (IMC) at the interfaces in nanoscale and microscale thickness Cu-Sn-Cu sandwich structure (with different solder layer thicknesses of 130nm, 400nm and 1.5μm) during reflow soldering and aging were studied. The sandwich structure samples were fabricated by electro-plating, and followed by reflow and aging process. It was found that solder layers (Sn layers) might be totally consumed in the soldering and aging process when the thickness is sub-micron. For samples with solder layers of 130nm, we could even hardly find any evidence of the existence of Cu 6Sn 5 in the assoldered samples. For samples with solder layers of 400nm, both Cu 6Sn 5 phase and Cu 3Sn phase were detected in the assoldered samples, and Sn as well as Cu 6Sn 5 was consumed in the aging period. When solder layer reached 1.5μm, Cu 3Sn nucleated during aging but not the reflow process. Yet the overall thickness of IMC growth of these samples could not be described by the reported empirical parabolic curve of binary Cu-Sn couple's IMC growth, since the sub-micron solder layer was totally consumed by the growth of IMCs. {\textcopyright} 2011 IEEE.",

author = "Qingqian Li and Chan, \{Y. C.\} and Shafiq Ismathullakhan",

year = "2011",

doi = "10.1109/EPTC.2011.6184433",

language = "English",

isbn = "9781457719837",

pages = "289--293",

booktitle = "2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011",

note = "13th Electronics Packaging Technology Conference (EPTC 2011) ; Conference date: 07-12-2011 Through 09-12-2011",

}

Li, Q, Chan, YC & Ismathullakhan, S 2011, Growth characteristic study of intermetallic compounds growth in nanoscale-thickness Cu/Sn/Cu sandwich structure. in 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011., 6184433, pp. 289-293, 13th Electronics Packaging Technology Conference (EPTC 2011), Singapore, 7/12/11. https://doi.org/10.1109/EPTC.2011.6184433

Growth characteristic study of intermetallic compounds growth in nanoscale-thickness Cu/Sn/Cu sandwich structure. / Li, Qingqian; Chan, Y. C.; Ismathullakhan, Shafiq.
2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011. 2011. p. 289-293 6184433.

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

TY - GEN

T1 - Growth characteristic study of intermetallic compounds growth in nanoscale-thickness Cu/Sn/Cu sandwich structure

AU - Li, Qingqian

AU - Chan, Y. C.

AU - Ismathullakhan, Shafiq

PY - 2011

Y1 - 2011

N2 - The formation and growth characteristics of intermetallic compounds (IMC) at the interfaces in nanoscale and microscale thickness Cu-Sn-Cu sandwich structure (with different solder layer thicknesses of 130nm, 400nm and 1.5μm) during reflow soldering and aging were studied. The sandwich structure samples were fabricated by electro-plating, and followed by reflow and aging process. It was found that solder layers (Sn layers) might be totally consumed in the soldering and aging process when the thickness is sub-micron. For samples with solder layers of 130nm, we could even hardly find any evidence of the existence of Cu 6Sn 5 in the assoldered samples. For samples with solder layers of 400nm, both Cu 6Sn 5 phase and Cu 3Sn phase were detected in the assoldered samples, and Sn as well as Cu 6Sn 5 was consumed in the aging period. When solder layer reached 1.5μm, Cu 3Sn nucleated during aging but not the reflow process. Yet the overall thickness of IMC growth of these samples could not be described by the reported empirical parabolic curve of binary Cu-Sn couple's IMC growth, since the sub-micron solder layer was totally consumed by the growth of IMCs. © 2011 IEEE.

AB - The formation and growth characteristics of intermetallic compounds (IMC) at the interfaces in nanoscale and microscale thickness Cu-Sn-Cu sandwich structure (with different solder layer thicknesses of 130nm, 400nm and 1.5μm) during reflow soldering and aging were studied. The sandwich structure samples were fabricated by electro-plating, and followed by reflow and aging process. It was found that solder layers (Sn layers) might be totally consumed in the soldering and aging process when the thickness is sub-micron. For samples with solder layers of 130nm, we could even hardly find any evidence of the existence of Cu 6Sn 5 in the assoldered samples. For samples with solder layers of 400nm, both Cu 6Sn 5 phase and Cu 3Sn phase were detected in the assoldered samples, and Sn as well as Cu 6Sn 5 was consumed in the aging period. When solder layer reached 1.5μm, Cu 3Sn nucleated during aging but not the reflow process. Yet the overall thickness of IMC growth of these samples could not be described by the reported empirical parabolic curve of binary Cu-Sn couple's IMC growth, since the sub-micron solder layer was totally consumed by the growth of IMCs. © 2011 IEEE.

UR - https://www.scopus.com/pages/publications/84860910955

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-84860910955&origin=recordpage

U2 - 10.1109/EPTC.2011.6184433

DO - 10.1109/EPTC.2011.6184433

M3 - RGC 32 - Refereed conference paper (with host publication)

SN - 9781457719837

SP - 289

EP - 293

BT - 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011

T2 - 13th Electronics Packaging Technology Conference (EPTC 2011)

Y2 - 7 December 2011 through 9 December 2011

ER -

Growth characteristic study of intermetallic compounds growth in nanoscale-thickness Cu/Sn/Cu sandwich structure

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