Growth and ripening of (Au,Ni)Sn4 phase in Pb-free and Pb-containing solders on Ni/Au metallization

K. Y. Lee; M. Li; K. N. Tu

doi:10.1557/JMR.2003.0359

Growth and ripening of (Au,Ni)Sn₄ phase in Pb-free and Pb-containing solders on Ni/Au metallization

K. Y. Lee, M. Li, K. N. Tu

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

30 Citations (Scopus)

Abstract

The evolution of an interfacial microstructure between Cu/Ni/Au bond-pad metallization and Pb-free or Pb-containing solder bumps during solid-state aging was investigated. A distinctive difference between the Pb-containing and Pb-free solder bumps was observed. A continuous (Au,Ni)Sn₄ intermetallic compound layer was readily detected in the Pb-containing solder bump on the bond-pad. No such layer exists in the Pb-free case; instead a large number of (Au,Ni)Sn₄ particles scatter in the bulk of the solder. The different morphologies of the (Au,Ni)Sn₄ have been explained on the basis of the contact angle in Young's equation and of the growth of a flat layer by ripening. A simple kinetic analysis of ripening between a set of monosize spheres and a flat surface is given to describe the layered growth having a time dependence around 0.5.

Original language	English
Pages (from-to)	2562-2570
Journal	Journal of Materials Research
Volume	18
Issue number	11
DOIs	https://doi.org/10.1557/JMR.2003.0359
Publication status	Published - Nov 2003
Externally published	Yes

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title = "Growth and ripening of (Au,Ni)Sn4 phase in Pb-free and Pb-containing solders on Ni/Au metallization",

abstract = "The evolution of an interfacial microstructure between Cu/Ni/Au bond-pad metallization and Pb-free or Pb-containing solder bumps during solid-state aging was investigated. A distinctive difference between the Pb-containing and Pb-free solder bumps was observed. A continuous (Au,Ni)Sn4 intermetallic compound layer was readily detected in the Pb-containing solder bump on the bond-pad. No such layer exists in the Pb-free case; instead a large number of (Au,Ni)Sn4 particles scatter in the bulk of the solder. The different morphologies of the (Au,Ni)Sn4 have been explained on the basis of the contact angle in Young's equation and of the growth of a flat layer by ripening. A simple kinetic analysis of ripening between a set of monosize spheres and a flat surface is given to describe the layered growth having a time dependence around 0.5.",

author = "Lee, {K. Y.} and M. Li and Tu, {K. N.}",

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AU - Lee, K. Y.

AU - Li, M.

AU - Tu, K. N.

N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

PY - 2003/11

Y1 - 2003/11

N2 - The evolution of an interfacial microstructure between Cu/Ni/Au bond-pad metallization and Pb-free or Pb-containing solder bumps during solid-state aging was investigated. A distinctive difference between the Pb-containing and Pb-free solder bumps was observed. A continuous (Au,Ni)Sn4 intermetallic compound layer was readily detected in the Pb-containing solder bump on the bond-pad. No such layer exists in the Pb-free case; instead a large number of (Au,Ni)Sn4 particles scatter in the bulk of the solder. The different morphologies of the (Au,Ni)Sn4 have been explained on the basis of the contact angle in Young's equation and of the growth of a flat layer by ripening. A simple kinetic analysis of ripening between a set of monosize spheres and a flat surface is given to describe the layered growth having a time dependence around 0.5.

AB - The evolution of an interfacial microstructure between Cu/Ni/Au bond-pad metallization and Pb-free or Pb-containing solder bumps during solid-state aging was investigated. A distinctive difference between the Pb-containing and Pb-free solder bumps was observed. A continuous (Au,Ni)Sn4 intermetallic compound layer was readily detected in the Pb-containing solder bump on the bond-pad. No such layer exists in the Pb-free case; instead a large number of (Au,Ni)Sn4 particles scatter in the bulk of the solder. The different morphologies of the (Au,Ni)Sn4 have been explained on the basis of the contact angle in Young's equation and of the growth of a flat layer by ripening. A simple kinetic analysis of ripening between a set of monosize spheres and a flat surface is given to describe the layered growth having a time dependence around 0.5.

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DO - 10.1557/JMR.2003.0359

M3 - RGC 21 - Publication in refereed journal

SN - 0884-2914

VL - 18

SP - 2562

EP - 2570

JO - Journal of Materials Research

JF - Journal of Materials Research

IS - 11

ER -