Growth and Characterizations of Superconducting FeSe Films on Flexible F-mica Substrates

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Author(s)

  • Liping Zhang
  • Juan Xu
  • Mingyang Qin
  • Ruozhou Zhang
  • Chuqing Xia
  • Fung Tsz Fung
  • Jingsong Zhang
  • Jie Yuan
  • Beiyi Zhu
  • Jun Miao
  • Kui Jin

Detail(s)

Original languageEnglish
Article number1800405
Number of pages5
Journal / PublicationIEEE Transactions on Applied Superconductivity
Volume33
Issue number3
Online published12 Jan 2023
Publication statusPublished - Apr 2023

Abstract

This article first reports the preparation of superconducting FeSe films on fluorophlogopite-mica (F-mica) substrates by the pulsed laser deposition technique. The quality of films is significantly improved by optimizing the deposition conditions, such as substrate temperature and laser energy. Through mechanical exfoliation of F-mica substrates, the films obtain excellent flexibility. After repeated bending in the atmosphere, the surface morphology and superconducting properties of these films substantially remain unchanged. Furthermore, we use a homemade device to apply different stains to the film and conclude that the superconducting transition temperature could be enhanced under compressive strain, whereas reduced under tensile strain. This article shows the great potential of FeSe superconducting films to integrate with future flexible electronic devices. © IEEE

Research Area(s)

  • fluorophlogopite-mica (F-mica substrate), FeSe superconducting film, Films, flexible electronics, Strain, Substrates, Superconducting thin films, Superconducting transition temperature, Superconductivity, Temperature measurement

Citation Format(s)

Growth and Characterizations of Superconducting FeSe Films on Flexible F-mica Substrates. / Zhang, Liping; Xu, Juan; Qin, Mingyang et al.

In: IEEE Transactions on Applied Superconductivity, Vol. 33, No. 3, 1800405, 04.2023.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review