Grain growth by DIGM in Ni thin film under high tensile stress

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Original languageEnglish
Pages (from-to)95-101
Journal / PublicationMaterials Research Society Symposium - Proceedings
Publication statusPublished - 1998
Externally publishedYes


TitleProceedings of the 1998 MRS Spring Meeting
CitySan Francisco, CA, USA
Period13 - 16 April 1998


Electron beam evaporated Ni thin films are found to have tensile stress of 1.2 Gpa. The stress is relieved upon heating, accompanied by grain growth. The calculated stress matches the experimental result and a mechanism of grain growth is proposed.

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