TY - JOUR
T1 - Grain growth by DIGM in Ni thin film under high tensile stress
AU - Jia, Zhengyi
AU - Pan, G. Z.
AU - Tu, K. N.
N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].
PY - 1998
Y1 - 1998
N2 - Electron beam evaporated Ni thin films are found to have tensile stress of 1.2 Gpa. The stress is relieved upon heating, accompanied by grain growth. The calculated stress matches the experimental result and a mechanism of grain growth is proposed.
AB - Electron beam evaporated Ni thin films are found to have tensile stress of 1.2 Gpa. The stress is relieved upon heating, accompanied by grain growth. The calculated stress matches the experimental result and a mechanism of grain growth is proposed.
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U2 - 10.1557/proc-516-95
DO - 10.1557/proc-516-95
M3 - RGC 21 - Publication in refereed journal
SN - 0272-9172
VL - 516
SP - 95
EP - 101
JO - Materials Research Society Symposium - Proceedings
JF - Materials Research Society Symposium - Proceedings
T2 - Proceedings of the 1998 MRS Spring Meeting
Y2 - 13 April 1998 through 16 April 1998
ER -