Grain boundary electromigration and creep

K. N. Tu; L. M. Brown

doi:10.1016/0254-0584(92)90247-6

Grain boundary electromigration and creep

K. N. Tu
, L. M. Brown

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

2 Citations (Scopus)

Abstract

We have applied the thermodynamics of irreversible processes to grain boundary electromigration and creep at moderated temperatures in fine-grained thin film lines. In response to the forces of electrical field and mechanical stress, atomic motion in the lines occurs via two kinds of kinetic paths; lattice diffusion and grain boundary diffusion. The extreme cases, where each of them becomes dominant, have been analyzed. We show that the effective charge number of grain boundary electromigration can be determined by measuring the back-stress in a fine-grained short line. In the reverse case the back-stress can be measured from the electromigration damage. The deformation potential due to grain boundary creep is negligible according to Onsager's reciprocity relation. © 1992.

Original language	English
Pages (from-to)	49-55
Journal	Materials Chemistry and Physics
Volume	32
Issue number	1
DOIs	https://doi.org/10.1016/0254-0584(92)90247-6
Publication status	Published - Jul 1992
Externally published	Yes

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Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

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title = "Grain boundary electromigration and creep",

abstract = "We have applied the thermodynamics of irreversible processes to grain boundary electromigration and creep at moderated temperatures in fine-grained thin film lines. In response to the forces of electrical field and mechanical stress, atomic motion in the lines occurs via two kinds of kinetic paths; lattice diffusion and grain boundary diffusion. The extreme cases, where each of them becomes dominant, have been analyzed. We show that the effective charge number of grain boundary electromigration can be determined by measuring the back-stress in a fine-grained short line. In the reverse case the back-stress can be measured from the electromigration damage. The deformation potential due to grain boundary creep is negligible according to Onsager's reciprocity relation. {\textcopyright} 1992.",

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doi = "10.1016/0254-0584(92)90247-6",

language = "English",

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pages = "49--55",

journal = "Materials Chemistry and Physics",

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T1 - Grain boundary electromigration and creep

AU - Tu, K. N.

AU - Brown, L. M.

N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

PY - 1992/7

Y1 - 1992/7

N2 - We have applied the thermodynamics of irreversible processes to grain boundary electromigration and creep at moderated temperatures in fine-grained thin film lines. In response to the forces of electrical field and mechanical stress, atomic motion in the lines occurs via two kinds of kinetic paths; lattice diffusion and grain boundary diffusion. The extreme cases, where each of them becomes dominant, have been analyzed. We show that the effective charge number of grain boundary electromigration can be determined by measuring the back-stress in a fine-grained short line. In the reverse case the back-stress can be measured from the electromigration damage. The deformation potential due to grain boundary creep is negligible according to Onsager's reciprocity relation. © 1992.

AB - We have applied the thermodynamics of irreversible processes to grain boundary electromigration and creep at moderated temperatures in fine-grained thin film lines. In response to the forces of electrical field and mechanical stress, atomic motion in the lines occurs via two kinds of kinetic paths; lattice diffusion and grain boundary diffusion. The extreme cases, where each of them becomes dominant, have been analyzed. We show that the effective charge number of grain boundary electromigration can be determined by measuring the back-stress in a fine-grained short line. In the reverse case the back-stress can be measured from the electromigration damage. The deformation potential due to grain boundary creep is negligible according to Onsager's reciprocity relation. © 1992.

UR - https://www.scopus.com/pages/publications/10444278831

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-10444278831&origin=recordpage

U2 - 10.1016/0254-0584(92)90247-6

DO - 10.1016/0254-0584(92)90247-6

M3 - RGC 21 - Publication in refereed journal

SN - 0254-0584

VL - 32

SP - 49

EP - 55

JO - Materials Chemistry and Physics

JF - Materials Chemistry and Physics

IS - 1

ER -

Grain boundary electromigration and creep

Abstract

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