Abstract
We have studied the diffusion of Co along grain boundaries of ultrafme-grained (UFG) Ti as well as the creep behaviors of UFG Ti and Ti-6Al-4V alloy. It is found that the activation energy of grain boundary diffusion of Co in UFG Ti is smaller than that in coarse-grained Ti. The creep activation energies in UFG Ti and Ti-6Al-4V are also lower than those in their respective coarse-grained counterparts. We attribute the lower activation energy of grain boundary diffusion to the non-equilibrium grain boundary in UFG Ti. The difference in the creep activation energies of UFG and coarse-grained Ti and Ti-6Al-4V is explained by different contributions of grain boundary sliding to the overall deformation.
| Original language | English |
|---|---|
| Title of host publication | Ultrafine Grained Materials III |
| Editors | Yuntian T. Zhu, Terence G. Langdon, Ruslan Z. Valiev, S. Lee Semiatin, Dong H. Shin, Terry C. Lowe |
| Publisher | Minerals, Metals & Materials Society |
| Pages | 621-628 |
| ISBN (Print) | 0873395719, 9780873395717 |
| Publication status | Published - Mar 2004 |
| Externally published | Yes |
| Event | 2004 TMS Annual Meeting: Ultrafine Grained Materials III - Charlotte, NC., United States Duration: 14 Mar 2004 → 18 Mar 2004 Conference number: 133rd https://www.tms.org/meetings/annual-04/annmtg04home.html https://www.tms.org/Meetings/Annual-04/TechProg/Annual04-techprog-full.pdf https://www.tib.eu/en/search/id/TIBKAT%3A385812965/Ultrafine-grained-materials-III-proceedings-of/ |
Conference
| Conference | 2004 TMS Annual Meeting |
|---|---|
| Place | United States |
| City | Charlotte, NC. |
| Period | 14/03/04 → 18/03/04 |
| Internet address |
Research Keywords
- Creep
- Diffusion
- Non-equilibrium grain boundary
- Ti
- Ti-6al-4v
Fingerprint
Dive into the research topics of 'Grain boundary diffusion and creep of UFG Ti and Ti-6Al-4V alloy processed by severe plastic deformation'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver