Graded nanostructured interfacial layers fabricated by high power pulsed magnetron sputtering - plasma immersion ion implantation and deposition (HPPMS-PIII&D)

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

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Author(s)

  • Zhongzhen Wu
  • Xiubo Tian
  • Yongqiang Wei
  • Chunzhi Gong
  • Shiqin Yang
  • Feng Pan

Detail(s)

Original languageEnglish
Pages (from-to)320-325
Journal / PublicationSurface and Coatings Technology
Volume236
Publication statusPublished - 15 Dec 2013

Abstract

A nanostructured interfacial layer with a graded structure is produced by hybrid high-power pulsed magnetron sputtering-plasma immersion ion implantation and deposition (HPPMS-PIII&D) to improve adhesion of multi-functional coatings. As a demonstration, a ceramic CrN film is prepared on stainless steel together with a Cr interlayer. High-resolution transmission electron microscopy (HR-TEM) reveals the presence of a 40. nm thick nanostructured interfacial layer between the Cr interlayer and substrate with gradually changing compositions, and this layer which possesses a dense and pore/void free structure is responsible for the strong film adhesion. The hybrid technology combines the benefits of both the HPPMS and PIII&D enabling fabrication of functional films with the desired properties. The technique and fabrication strategy have many potential applications in photovoltaics, energy storage, tribology, lubrication, aeronautics, and astronautics. © 2013.

Research Area(s)

  • CrN layer, High-power pulsed magnetron sputtering, Interface, Plasma immersion ion implantation and deposition, Stress

Citation Format(s)

Graded nanostructured interfacial layers fabricated by high power pulsed magnetron sputtering - plasma immersion ion implantation and deposition (HPPMS-PIII&D). / Wu, Zhongzhen; Tian, Xiubo; Wei, Yongqiang; Gong, Chunzhi; Yang, Shiqin; Pan, Feng; Chu, Paul K.

In: Surface and Coatings Technology, Vol. 236, 15.12.2013, p. 320-325.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal