Abstract
Bulk silicon is not susceptible to high-cycle fatigue but micron-scale silicon films are. Using polysilicon resonators to determine stress-lifetime fatigue behavior in several environments, oxide layers are found to show up to four-fold thickening after cycling, which is not seen after monotonic loading or after cycling in vacuo. We believe that the mechanism of thin-film silicon fatigue is "reaction-layer fatigue", involving cyclic stress-induced thickening of the oxide and moisture-assisted cracking within this layer.
| Original language | English |
|---|---|
| Pages (from-to) | 931-935 |
| Journal | Scripta Materialia |
| Volume | 59 |
| Issue number | 9 |
| Online published | 16 Apr 2008 |
| DOIs | |
| Publication status | Published - Nov 2008 |
| Externally published | Yes |
Research Keywords
- Fatigue
- MEMS
- Reaction-layer fatigue
- Silicon
Fingerprint
Dive into the research topics of 'Further considerations on the high-cycle fatigue of micron-scale polycrystalline silicon'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver