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Further considerations on the high-cycle fatigue of micron-scale polycrystalline silicon

  • D.H. Alsem
  • , C.L. Muhlstein
  • , E.A. Stach
  • , R.O. Ritchie*
  • *Corresponding author for this work

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

Abstract

Bulk silicon is not susceptible to high-cycle fatigue but micron-scale silicon films are. Using polysilicon resonators to determine stress-lifetime fatigue behavior in several environments, oxide layers are found to show up to four-fold thickening after cycling, which is not seen after monotonic loading or after cycling in vacuo. We believe that the mechanism of thin-film silicon fatigue is "reaction-layer fatigue", involving cyclic stress-induced thickening of the oxide and moisture-assisted cracking within this layer.
Original languageEnglish
Pages (from-to)931-935
JournalScripta Materialia
Volume59
Issue number9
Online published16 Apr 2008
DOIs
Publication statusPublished - Nov 2008
Externally publishedYes

Research Keywords

  • Fatigue
  • MEMS
  • Reaction-layer fatigue
  • Silicon

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