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Formation mechanisms for the dominant kinks with different angles in InP nanowires

  • Minghuan Zhang
  • , Fengyun Wang*
  • , Chao Wang
  • , Yiqian Wang*
  • , SenPo Yip
  • , Johnny C. Ho
  • *Corresponding author for this work

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    88 Downloads (CityUHK Scholars)

    Abstract

    The morphologies and microstructures of kinked InP nanowires (NWs) prepared by solid-source chemical vapor deposition method were examined using scanning electron microscopy (SEM) and high-resolution transmission electron microscopy (HRTEM). Statistical analysis and structural characterization reveal that four different kinds of kinks are dominant in the grown InP NWs with a bending angle of approximately 70°, 90°, 110°, and 170°, respectively. The formation mechanisms of these kinks are discussed. Specifically, the existence of kinks with bending angles of approximately 70° and 110° are mainly attributed to the occurrence of stacking faults and nanotwins in the NWs, which could easily form by the glide of {111} planes, while approximately 90° kinks result from the local amorphorization of InP NWs. Also, approximately 170° kinks are mainly caused by small-angle boundaries, where the insertion of extra atomic planes could make the NWs slightly bent. In addition, multiple kinks with various angles are also observed. Importantly, all these results are beneficial to understand the formation mechanisms of kinks in compound semiconductor NWs, which could guide the design of nanostructured materials, morphologies, microstructures, and/or enhanced mechanical properties.
    Original languageEnglish
    Article number211
    JournalNanoscale Research Letters
    Volume9
    Online published5 May 2014
    DOIs
    Publication statusPublished - 2014

    Research Keywords

    • Formation mechanism
    • HRTEM
    • InP nanowires
    • Kinks
    • Microstructures

    Publisher's Copyright Statement

    • This full text is made available under CC-BY 4.0. https://creativecommons.org/licenses/by/4.0/

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