Finite-element stress analysis of failure mechanisms in a multilevel metallization structure

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

19 Scopus Citations
View graph of relations



Original languageEnglish
Pages (from-to)3037-3041
Journal / PublicationJournal of Applied Physics
Issue number7
Publication statusPublished - 1995
Externally publishedYes


A finite-element method taking into account material nonlinearity was used to calculate the stress distribution in interconnecting lines and studs of a three-dimensional multilevel metallization structure in a microelectronic device. A good correlation was obtained between the location of calculated stress concentration centers and the experimentally observed void sites in the stud. Accordingly, the failure mechanisms of the stress-induced voiding in the stud and the crack formation in the underlying substrate were inferred to be associated with different stress components. Furthermore, the stress concentration centers were found to migrate as the temperature changes, which agrees with the experimental observations. © 1995 American Institute of Physics.

Bibliographic Note

Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].