Fatigue and fracture of a bulk nanocrystalline NiFe alloy

Y. Yang, B. Imasogie, G. J. Fan, Peter K. Liaw, W. O. Soboyejo

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

46 Citations (Scopus)

Abstract

This article presents the results of an experimental study of fracture and fatigue in a nanostructured (an average grain size of ∼23 nm) bulk Ni-18 wt pct Fe alloy that was produced using a pulsed electrodeposition technique. The fracture behavior of the alloy is investigated using fracture resistance experiments, while the fatigue behavior is studied in fatigue crack growth experiments. The alloy exhibits limited toughening as the crack initiates at a fracture toughness of about 25 MPa√m and propagates with a slight increase to a plateau value of about 30 MPa√m. The limited toughening arises from the slight increase in the crack-tip plastic-deformation zone at the early crack growth and ligament bridging due to the microcrack formation ahead of the tip of the main crack. In contrast with a flat fatigue-crack wake, a wavy crack wake was observed under monotonic loading. This trend is attributed to the following: (a) nanovoid coalescence at grain boundaries, (b) microcrack formation by joining nanovoids, and (c) the linking of microcracks with the main crack through the fracture of inclined bridging ligaments. The fractured surface is shown to contain ductile dimple structures with average diameters of ∼100 nm. Focused-ion-beam (FIB) methods are also used to study fatigue-crack growth. These results show that fatigue crack growth occurs by the coalescence of nanovoids that form ahead of the crack tip. The observed mechanisms of fatigue crack growth are shown to be consistent with the results of prior atomistic simulations. © The Minerals, Metals & Materials Society and ASM International 2008.
Original languageEnglish
Pages (from-to)1145-1156
JournalMetallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
Volume39 A
Issue number5
DOIs
Publication statusPublished - May 2008
Externally publishedYes

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