TY - JOUR
T1 - Fast soldering reactions on Au foils
AU - Kim, P. G.
AU - Tu, K. N.
N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].
PY - 1997
Y1 - 1997
N2 - We have studied the wetting behaviors and interfacial reactions of Pb-containing (63Sn-37Pb, 95Pb-5Sn) and Pb-free solders (pure Sn, 96Sn-4Ag, 57Bi-43Sn, 77.2Sn-20In-2.8Ag) on Au foils in order to understand the role of Pb in Pb-based solders. Surface morphology, wetting angle, and interfacial reaction of the solders were studied by Scanning Electron Microscopy (SEM) and Energy Dispersive X-ray Analysis (EDX). Pb-containing and Pb-free solders (pure Sn, 96Sn-4Ag, 77.2Sn-20In-2.8Ag) showed rough surfaces due to the precipitation of intermetallic compounds on the surface of the solder caps. The eutectic SnBi (57Bi-43Sn) solder, however, showed a smoother surface. The wetting angle of the eutectic SnPb (63Sn-37Pb), pure Sn, 96Sn-4Ag, and 77.2Sn-20In-2.8Ag solders decreased significantly with reflow time, while the eutectic SnBi and 95Pb-5Sn solders showed a much smaller decrease. A large amount of intermetallic compounds was formed throughout the entire region of the solder cap for the eutectic SnPb, 96Sn-4Ag, 95Pb-5Sn, and 77.2Sn-20In-2.8Ag, mainly due to the high solubility of Au in these solders. Slow intermetallic compound growth was observed for the eutectic SnBi solder.
AB - We have studied the wetting behaviors and interfacial reactions of Pb-containing (63Sn-37Pb, 95Pb-5Sn) and Pb-free solders (pure Sn, 96Sn-4Ag, 57Bi-43Sn, 77.2Sn-20In-2.8Ag) on Au foils in order to understand the role of Pb in Pb-based solders. Surface morphology, wetting angle, and interfacial reaction of the solders were studied by Scanning Electron Microscopy (SEM) and Energy Dispersive X-ray Analysis (EDX). Pb-containing and Pb-free solders (pure Sn, 96Sn-4Ag, 77.2Sn-20In-2.8Ag) showed rough surfaces due to the precipitation of intermetallic compounds on the surface of the solder caps. The eutectic SnBi (57Bi-43Sn) solder, however, showed a smoother surface. The wetting angle of the eutectic SnPb (63Sn-37Pb), pure Sn, 96Sn-4Ag, and 77.2Sn-20In-2.8Ag solders decreased significantly with reflow time, while the eutectic SnBi and 95Pb-5Sn solders showed a much smaller decrease. A large amount of intermetallic compounds was formed throughout the entire region of the solder cap for the eutectic SnPb, 96Sn-4Ag, 95Pb-5Sn, and 77.2Sn-20In-2.8Ag, mainly due to the high solubility of Au in these solders. Slow intermetallic compound growth was observed for the eutectic SnBi solder.
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U2 - 10.1557/proc-445-131
DO - 10.1557/proc-445-131
M3 - RGC 21 - Publication in refereed journal
SN - 0272-9172
VL - 445
SP - 131
EP - 136
JO - Materials Research Society Symposium - Proceedings
JF - Materials Research Society Symposium - Proceedings
T2 - Proceedings of the 1996 MRS Fall Symposium
Y2 - 3 December 1996 through 5 December 1996
ER -