Fast soldering reactions on Au foils

P. G. Kim; K. N. Tu

doi:10.1557/proc-445-131

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Fast soldering reactions on Au foils

Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

Overview

7 Scopus Citations

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Author(s)

P. G. Kim
K. N. Tu

Detail(s)

Original language	English
Pages (from-to)	131-136
Journal / Publication	Materials Research Society Symposium - Proceedings
Volume	445
Publication status	Published - 1997
Externally published	Yes

Conference

Title	Proceedings of the 1996 MRS Fall Symposium
City	Boston, MA, USA
Period	3 - 5 December 1996

Link(s)

DOI	DOI https://doi.org/10.1557/proc-445-131 Final Published version
	Check@CityULib
Link to Scopus	https://www.scopus.com/record/display.uri?eid=2-s2.0-0031381337&origin=recordpage
Permanent Link	https://scholars.cityu.edu.hk/en/publications/publication(38736f8e-f103-4c80-b6b8-026d253afc0b).html

Abstract

We have studied the wetting behaviors and interfacial reactions of Pb-containing (63Sn-37Pb, 95Pb-5Sn) and Pb-free solders (pure Sn, 96Sn-4Ag, 57Bi-43Sn, 77.2Sn-20In-2.8Ag) on Au foils in order to understand the role of Pb in Pb-based solders. Surface morphology, wetting angle, and interfacial reaction of the solders were studied by Scanning Electron Microscopy (SEM) and Energy Dispersive X-ray Analysis (EDX). Pb-containing and Pb-free solders (pure Sn, 96Sn-4Ag, 77.2Sn-20In-2.8Ag) showed rough surfaces due to the precipitation of intermetallic compounds on the surface of the solder caps. The eutectic SnBi (57Bi-43Sn) solder, however, showed a smoother surface. The wetting angle of the eutectic SnPb (63Sn-37Pb), pure Sn, 96Sn-4Ag, and 77.2Sn-20In-2.8Ag solders decreased significantly with reflow time, while the eutectic SnBi and 95Pb-5Sn solders showed a much smaller decrease. A large amount of intermetallic compounds was formed throughout the entire region of the solder cap for the eutectic SnPb, 96Sn-4Ag, 95Pb-5Sn, and 77.2Sn-20In-2.8Ag, mainly due to the high solubility of Au in these solders. Slow intermetallic compound growth was observed for the eutectic SnBi solder.

Bibliographic Note

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