Abstract
Ball Grid Array (BGA) is an important method of packaging technology and is widely used in semiconductor industry. With the high requirement to consumer electronic devices, the total power increases a lot and the input current is significantly enhanced. BGA, served as a trunk in the advanced packaging structure such as three-dimensional integrated circuit (3D IC), suffers from higher and higher current density. Therefore, electromigration (EM) reliability issues in the BGA become important and determine the quality of the device. In this paper, we report a failure mode in 500 pm-BGA induced by EM test. After the current stress of 4600 A/cm2 and 160 °C for 612h, open failure was observed at the cathodic contacting area between thin Cu UBM and solder joint. Infrared (IR) temperature measurement proved that the local area exhibits the most severe Joule heating effect and the highest temperature during the current stress. Finite element analysis (FEA) showed that current crowding at the area is serious due to small crosssectional area. High temperature and current density increase the driving force of EM, leading to the void formation and open failure. Besides, dynamic void formation process at the failure site was simulated by inputting the equation of atomic flux induced by EM. Impact of current density and temperature on the EM failure was manifested. This paper demonstrates a failure mode in BGA during EM, and proves the mechanism behind it by IR test and FEA simulation. © 2023 IEEE.
| Original language | English |
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| Title of host publication | Proceedings of the 25th Electronics Packaging Technology Conference (EPTC 2023) |
| Editors | Andrew TAY, King Jien CHUI, Yeow Kheng LIM, Chuan Seng TAN, Sunmi SHIN |
| Publisher | IEEE |
| Pages | 316-319 |
| ISBN (Electronic) | 9798350329575 |
| ISBN (Print) | 9798350329582 |
| DOIs | |
| Publication status | Published - Dec 2023 |
| Event | 25th Electronics Packaging Technology Conference (EPTC 2023) - , Singapore Duration: 5 Dec 2023 → 8 Dec 2023 |
Publication series
| Name | Proceedings of the Electronics Packaging Technology Conference, EPTC |
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Conference
| Conference | 25th Electronics Packaging Technology Conference (EPTC 2023) |
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| Abbreviated title | EPTC2023 |
| Country/Territory | Singapore |
| Period | 5/12/23 → 8/12/23 |
Funding
The authors would like to thank the support from City University of Hong Kong through the start-up grant for newly recruited faculty members (Grant number 9610566).