Failure modes and FEM analysis of microelectronic packaging

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Author(s)

  • Guoyun Lu
  • Dayong Hu

Detail(s)

Original languageEnglish
Pages (from-to)455-458
Journal / PublicationKey Engineering Materials
Volume324-325 I
Publication statusPublished - 2006
Externally publishedYes

Abstract

Based on the theory of thermo-elasticity mechanics, the finite element numerical simulation models have been established for the package bulging process. The mechanism of the interfacial void evolution is postulated. By taking the interface strength as function of process (moisture and temperature), it shows that the critical stress that results in the unstable void growth and delamination at the interface is significantly reduced and becomes comparable to the magnitude of the vapor pressure. The simulation result can make us understand the mechanism of the void-growth at the interface framework and provide data base for improving reliability of package and optimum design.

Research Area(s)

  • Electronic packaging, Finite element, Thermo-elasticity mechanics

Citation Format(s)

Failure modes and FEM analysis of microelectronic packaging. / Lu, Guoyun; Hu, Dayong.

In: Key Engineering Materials, Vol. 324-325 I, 2006, p. 455-458.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review