Failure mechanisms of solder interconnects under current stressing - a progress update from recent studies on novel interconnect materials

Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

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Detail(s)

Original languageEnglish
Title of host publicationProceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages417-426
ISBN (Print)9781509043682, 9781509043699
Publication statusPublished - Nov 2016

Conference

TitleIEEE 18th Electronics Packaging Technology Conference (EPTC 2016)
LocationSuntec Singapore Convention & Exhibition Centre
PlaceSingapore
Period30 November - 3 December 2016

Abstract

In recent years, the application of solder interconnections in some special electronic products and the requirement for solders with higher reliability has promoted the emergence of novel interconnect materials. Arising from increasing demand for portability and miniaturization in electronic products, two key fundamental factors have been identified as causes of reliability problems: 1. thermal stress, and 2. electrical stress. These are the stresses that occur in electronic circuits during operation [1]. The research progress of research on solder interconnects under current stressing performed by Prof. Y. C. Chan's group and his cooperative partners groups listed as authors under the paper title, will be reviewed in this paper.

Citation Format(s)

Failure mechanisms of solder interconnects under current stressing - a progress update from recent studies on novel interconnect materials. / Chan, Yan Cheong; Li, Yi; Wu, Fengshun et al.

Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC). Institute of Electrical and Electronics Engineers Inc., 2016. p. 417-426 7861514.

Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review