Failure mechanisms of solder interconnects under current stressing - a progress update from recent studies on novel interconnect materials

In recent years, the application of solder interconnections in some special electronic products and the requirement for solders with higher reliability has promoted the emergence of novel interconnect materials. Arising from increasing demand for portability and miniaturization in electronic products, two key fundamental factors have been identified as causes of reliability problems: 1. thermal stress, and 2. electrical stress. These are the stresses that occur in electronic circuits during operation [1]. The research progress of research on solder interconnects under current stressing performed by Prof. Y. C. Chan's group and his cooperative partners groups listed as authors under the paper title, will be reviewed in this paper.