Fabrication of smart card using UV curable Anisotropic Conductive Adhesive (ACA) part I: Optimization of the curing conditions

K. K. Lee; K. T. Ng; C. W. Tan; Y. C. Chan; L. M. Cheng

Fabrication of smart card using UV curable Anisotropic Conductive Adhesive (ACA) part I: Optimization of the curing conditions

K. K. Lee, K. T. Ng, C. W. Tan, Y. C. Chan, L. M. Cheng

Department of Electrical Engineering

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

8 Citations (Scopus)

Abstract

Highly demand of green electronics products has driven the use of conductive adhesive as the substitution of using conventional solders. Recently developed UV curable Anisotropic Conductive Adhesive (ACA) is suggested to be used in temperature sensitive electronic packages. The aim of this study is to optimize the bonding conditions for fabrication of smart card using UV curable ACA. A simple designed copper coil plated on a PET was used as the micro strip antenna of the smart card. The entire fabrication process is divided into three parts, high power UV curing, chip-on-flex (COF) bonding & post curing. By varying the UV curing & post-curing parameters, a number of contactless smart cards were made. Chemical analysis using FTIR (Fourier Transform Infra Red Spectroscopy) was carried out to determine the curing degree of the UV curable ACA under different curing conditions. In order to quantify the performance of the smart card, the read range between the card reader and the sample was measured. Besides, shear test was performed; the shear force that is required to break the ACA joint and its failure mode was recorded and discussed. ACA joints of the smart cards under different curing conditions were also cross-sectioned and examined using SEM (Scanning Electron Microscope). By comparing the results in curing degree, shear strength of the ACA joint and the reading distance of the smart card samples, a set of parameters which gave better performance of the COF bonding were determined.

Original language	English
Title of host publication	Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability
Pages	134-139
Publication status	Published - 2004
Event	Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability - Shanghai, China Duration: 27 Apr 2004 → 30 Apr 2004

Conference

Conference	Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability
Place	China
City	Shanghai
Period	27/04/04 → 30/04/04

Research Keywords

Chip-on-flex (COF)
Contactless smart card
UV curable anisotropic conductive adhesive (ACA)

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@inproceedings{0eb0ed3ea38c48a2a5e86f302f56ea57,

title = "Fabrication of smart card using UV curable Anisotropic Conductive Adhesive (ACA) part I: Optimization of the curing conditions",

abstract = "Highly demand of green electronics products has driven the use of conductive adhesive as the substitution of using conventional solders. Recently developed UV curable Anisotropic Conductive Adhesive (ACA) is suggested to be used in temperature sensitive electronic packages. The aim of this study is to optimize the bonding conditions for fabrication of smart card using UV curable ACA. A simple designed copper coil plated on a PET was used as the micro strip antenna of the smart card. The entire fabrication process is divided into three parts, high power UV curing, chip-on-flex (COF) bonding & post curing. By varying the UV curing & post-curing parameters, a number of contactless smart cards were made. Chemical analysis using FTIR (Fourier Transform Infra Red Spectroscopy) was carried out to determine the curing degree of the UV curable ACA under different curing conditions. In order to quantify the performance of the smart card, the read range between the card reader and the sample was measured. Besides, shear test was performed; the shear force that is required to break the ACA joint and its failure mode was recorded and discussed. ACA joints of the smart cards under different curing conditions were also cross-sectioned and examined using SEM (Scanning Electron Microscope). By comparing the results in curing degree, shear strength of the ACA joint and the reading distance of the smart card samples, a set of parameters which gave better performance of the COF bonding were determined.",

keywords = "Chip-on-flex (COF), Contactless smart card, UV curable anisotropic conductive adhesive (ACA)",

author = "Lee, {K. K.} and Ng, {K. T.} and Tan, {C. W.} and Chan, {Y. C.} and Cheng, {L. M.}",

year = "2004",

language = "English",

isbn = "780383613",

pages = "134--139",

booktitle = "Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability",

note = "Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability ; Conference date: 27-04-2004 Through 30-04-2004",

}

Lee, KK, Ng, KT, Tan, CW, Chan, YC & Cheng, LM 2004, Fabrication of smart card using UV curable Anisotropic Conductive Adhesive (ACA) part I: Optimization of the curing conditions. in Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability. pp. 134-139, Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability, Shanghai, China, 27/04/04.

Fabrication of smart card using UV curable Anisotropic Conductive Adhesive (ACA) part I: Optimization of the curing conditions. / Lee, K. K.; Ng, K. T.; Tan, C. W. et al.
Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability. 2004. p. 134-139.

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

TY - GEN

T1 - Fabrication of smart card using UV curable Anisotropic Conductive Adhesive (ACA) part I

T2 - Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability

AU - Lee, K. K.

AU - Ng, K. T.

AU - Tan, C. W.

AU - Chan, Y. C.

AU - Cheng, L. M.

PY - 2004

Y1 - 2004

N2 - Highly demand of green electronics products has driven the use of conductive adhesive as the substitution of using conventional solders. Recently developed UV curable Anisotropic Conductive Adhesive (ACA) is suggested to be used in temperature sensitive electronic packages. The aim of this study is to optimize the bonding conditions for fabrication of smart card using UV curable ACA. A simple designed copper coil plated on a PET was used as the micro strip antenna of the smart card. The entire fabrication process is divided into three parts, high power UV curing, chip-on-flex (COF) bonding & post curing. By varying the UV curing & post-curing parameters, a number of contactless smart cards were made. Chemical analysis using FTIR (Fourier Transform Infra Red Spectroscopy) was carried out to determine the curing degree of the UV curable ACA under different curing conditions. In order to quantify the performance of the smart card, the read range between the card reader and the sample was measured. Besides, shear test was performed; the shear force that is required to break the ACA joint and its failure mode was recorded and discussed. ACA joints of the smart cards under different curing conditions were also cross-sectioned and examined using SEM (Scanning Electron Microscope). By comparing the results in curing degree, shear strength of the ACA joint and the reading distance of the smart card samples, a set of parameters which gave better performance of the COF bonding were determined.

AB - Highly demand of green electronics products has driven the use of conductive adhesive as the substitution of using conventional solders. Recently developed UV curable Anisotropic Conductive Adhesive (ACA) is suggested to be used in temperature sensitive electronic packages. The aim of this study is to optimize the bonding conditions for fabrication of smart card using UV curable ACA. A simple designed copper coil plated on a PET was used as the micro strip antenna of the smart card. The entire fabrication process is divided into three parts, high power UV curing, chip-on-flex (COF) bonding & post curing. By varying the UV curing & post-curing parameters, a number of contactless smart cards were made. Chemical analysis using FTIR (Fourier Transform Infra Red Spectroscopy) was carried out to determine the curing degree of the UV curable ACA under different curing conditions. In order to quantify the performance of the smart card, the read range between the card reader and the sample was measured. Besides, shear test was performed; the shear force that is required to break the ACA joint and its failure mode was recorded and discussed. ACA joints of the smart cards under different curing conditions were also cross-sectioned and examined using SEM (Scanning Electron Microscope). By comparing the results in curing degree, shear strength of the ACA joint and the reading distance of the smart card samples, a set of parameters which gave better performance of the COF bonding were determined.

KW - Chip-on-flex (COF)

KW - Contactless smart card

KW - UV curable anisotropic conductive adhesive (ACA)

UR - http://www.scopus.com/inward/record.url?scp=4544323434&partnerID=8YFLogxK

UR - https://www.scopus.com/record/pubmetrics.uri?eid=2-s2.0-4544323434&origin=recordpage

M3 - RGC 32 - Refereed conference paper (with host publication)

SN - 780383613

SP - 134

EP - 139

BT - Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability

Y2 - 27 April 2004 through 30 April 2004

ER -

Fabrication of smart card using UV curable Anisotropic Conductive Adhesive (ACA) part I: Optimization of the curing conditions

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