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Fabrication and nanoindentation characterization of nickel micro-pillar mold for nanoimprint lithography

  • Mingjie Li*
  • , Wenxin Luo
  • , Yulong Chen
  • , Yini Zheng
  • , Xing Cheng
  • *Corresponding author for this work

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

Abstract

In this work, we develop a facile processing technique that tailors the microstructure of the void-free micro-pillars on a nickel substrate based on electroplating for applications in nanoimprint lithography (NIL). The obtained nickel pillars typically have an inhomogeneous microstructure consists of columnar grains and a multitude of nanocrystalline. The columnar grain size is refined when using alternating current, which is a result of the disrupted grain growth and promoted grain nucleation due to higher cathodic overpotential. The nickel micro-pillars produced by alternating current also yield a higher hardness of 3.5±0.2 GPa while maintaining a moderate plasticity index of 0.53±0.06. The enhanced mechanical strength of the micro-pillars through microstructure fine-tuning is potentially helpful for large-scale patterning by NIL for commercial manufacturing.
Original languageEnglish
Article number111636
JournalMicroelectronic Engineering
Volume250
Online published5 Oct 2021
DOIs
Publication statusPublished - 15 Oct 2021

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

  1. SDG 9 - Industry, Innovation, and Infrastructure
    SDG 9 Industry, Innovation, and Infrastructure

Research Keywords

  • Electroplating
  • Metallic mold
  • Microstructure
  • Nanoimprint
  • Nanoindentation

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