Abstract
In this work, we develop a facile processing technique that tailors the microstructure of the void-free micro-pillars on a nickel substrate based on electroplating for applications in nanoimprint lithography (NIL). The obtained nickel pillars typically have an inhomogeneous microstructure consists of columnar grains and a multitude of nanocrystalline. The columnar grain size is refined when using alternating current, which is a result of the disrupted grain growth and promoted grain nucleation due to higher cathodic overpotential. The nickel micro-pillars produced by alternating current also yield a higher hardness of 3.5±0.2 GPa while maintaining a moderate plasticity index of 0.53±0.06. The enhanced mechanical strength of the micro-pillars through microstructure fine-tuning is potentially helpful for large-scale patterning by NIL for commercial manufacturing.
| Original language | English |
|---|---|
| Article number | 111636 |
| Journal | Microelectronic Engineering |
| Volume | 250 |
| Online published | 5 Oct 2021 |
| DOIs | |
| Publication status | Published - 15 Oct 2021 |
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
-
SDG 9 Industry, Innovation, and Infrastructure
Research Keywords
- Electroplating
- Metallic mold
- Microstructure
- Nanoimprint
- Nanoindentation
Fingerprint
Dive into the research topics of 'Fabrication and nanoindentation characterization of nickel micro-pillar mold for nanoimprint lithography'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver