Fabrication and mechanism of relaxed SiGe-on-insulator by modified Ge condensation
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Author(s)
Detail(s)
Original language | English |
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Pages (from-to) | 1637-1640 |
Journal / Publication | Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures |
Volume | 23 |
Issue number | 4 |
Publication status | Published - 2005 |
Link(s)
Abstract
We have developed a modified technique to fabricate silicon-germanium on insulator (SGOI) starting with a sandwiched structure of SiSiGeSi. By means of oxidation and annealing, relaxed SiGe-on-insulator (SGOI) with a Ge fraction of 34% has been produced. Our results indicate that oxidation of the silicon cap suppresses Ge loss at the initial stage of the SiGe oxidation and the subsequent annealing process homogenizes the Ge fraction and also reduces Ge enrichment under the oxide. It is found that the strain in the SiGe layer is almost fully relaxed at high oxidation temperature (∼1150 °C) without generating any dislocations and crosshatch patterns that are commonly observed on the surface of a relaxed or partially relaxed SiGe layer on bulk Si substrate. © 2005 American Vacuum Society.
Citation Format(s)
Fabrication and mechanism of relaxed SiGe-on-insulator by modified Ge condensation. / Di, Zengfeng; Zhang, Miao; Liu, Weili et al.
In: Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, Vol. 23, No. 4, 2005, p. 1637-1640.
In: Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, Vol. 23, No. 4, 2005, p. 1637-1640.
Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review