Fabrication and cutting performance of CrA1N/CrA1 multilayer coatings deposited by continuous high-power magnetron sputtering

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Author(s)

  • Zhongzhen Wu
  • Tijun Li
  • Zhongcan Wu
  • Xiubo Tian
  • Ricky K.Y. Fu
  • Paul K. Chu

Detail(s)

Original languageEnglish
Pages (from-to)14528-14536
Number of pages9
Journal / PublicationCeramics International
Volume48
Issue number10
Online published4 Feb 2022
Publication statusPublished - 15 May 2022

Abstract

Continuous high-power magnetron sputtering (C-HPMS) is one of the desirable techniques to fabricate coatings with high hardness and a smooth surface to meet the demand by micro-millings for processing/cutting of printed circuit boards (PCBs). However, catastrophic failure can occur on the coatings because of the high residual stress in contact with hard glass fibers in PCBs at a high cutting speed. In this work, CrA1N/CrA1 multilayer coatings consisting of thin CrA1 interlayers are fabricated and characterized. The thin CrA1 layers reduce the residual stress significantly from −6.7 GPa to −1.5 GPa, while the hardness of 35 GPa is preserved. Furthermore, the adhesion strength and wear resistance are improved appreciably by addition of the interlayers. The PCB cutting tests reveal that the CrA1 layers mitigate sudden failure of the coatings and improve the cutting stability and service life by near two times.

Research Area(s)

  • C-HPMS, Micro-millings, Multilayers, PCB cutting, Residual stress

Citation Format(s)

Fabrication and cutting performance of CrA1N/CrA1 multilayer coatings deposited by continuous high-power magnetron sputtering. / Liu, Liangliang; Ruan, Qingdong; Wu, Zhongzhen; Li, Dan; Huang, Chao; Wu, Yuzheng; Li, Tijun; Wu, Zhongcan; Tian, Xiubo; Fu, Ricky K.Y.; Chu, Paul K.

In: Ceramics International, Vol. 48, No. 10, 15.05.2022, p. 14528-14536.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review