Fabrication and Characterization of Silicon Microchannel Plates as Temperature-Sensing Materials

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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Author(s)

  • Pengliang CI
  • Jing SHI
  • Fei WANG
  • Shaohui XU
  • Zhenya YANG
  • Pingxiong YANG
  • Lianwei WANG

Detail(s)

Original languageEnglish
Pages (from-to)2363-2367
Journal / PublicationJournal of Electronic Materials
Volume40
Issue number12
Online published13 Oct 2011
Publication statusPublished - Dec 2011

Abstract

Silicon microchannel plates (Si MCPs) are prepared by photo-assisted electrochemical etching (PAECE), and their temperature-sensing behavior based on the Seebeck effect is studied. In particular, the dependence of the temperature sensitivity on the orientation and pore size of the Si MCPs is determined in detail. Our results clarify the relationship between the temperature sensitivity and orientation of the Si MCPs. When the angle between the measured orientation and edge of the square micropore is 45°, the samples with pore dimensions of 5 μm × 5 μm and 3 μm × 3 μm show temperature sensitivities of 1.88 mV/°C and 0.93 mV/°C, respectively. In general, the sample with pore size of 5 μm × 5 μm exhibits higher sensitivity. Si MCPs which are compatible with integrated circuit (IC) processing have promising applications in integrated microtemperature sensing. © 2011 TMS.

Research Area(s)

  • electrochemical etching, Seebeck effect, Silicon microchannel plate, temperature sensor

Citation Format(s)

Fabrication and Characterization of Silicon Microchannel Plates as Temperature-Sensing Materials. / CI, Pengliang; SHI, Jing; WANG, Fei et al.
In: Journal of Electronic Materials, Vol. 40, No. 12, 12.2011, p. 2363-2367.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review