Abstract
Fine grained and nanotwinned Au has many excellent properties and is widely used in electronic devices. We have fabricated ⟨110⟩ preferred-oriented Au thin films by DC plating at 5 mA/cm2. Microstructure analysis of the films show a unique fine grain structure with a twin formation. Hardness tests performed on electroplated ⟨110⟩ Au films show a hardness 47% greater than random and untwinned Au. We then achieved direct bonding between two Au ⟨110⟩ surfaces operating at 200 °C for an hour in a vacuum oven. The highly-oriented ⟨110⟩ nanotwinned Au films could be an ideal material in many gold products.
| Original language | English |
|---|---|
| Article number | 16566 |
| Journal | Scientific Reports |
| Volume | 10 |
| Online published | 6 Oct 2020 |
| DOIs | |
| Publication status | Published - 2020 |
| Externally published | Yes |
Publisher's Copyright Statement
- This full text is made available under CC-BY 4.0. https://creativecommons.org/licenses/by/4.0/
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