Experimental study of ESD effect on metallic enclosure

Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review

2 Scopus Citations
View graph of relations

Author(s)

Related Research Unit(s)

Detail(s)

Original languageEnglish
Title of host publicationIEEE International Symposium on Electromagnetic Compatibility
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages490-492
Volume2002-January
ISBN (Print)780372778
Publication statusPublished - 2002

Publication series

Name
Volume2002-January
ISSN (Print)1077-4076
ISSN (Electronic)2158-1118

Conference

Title3rd International Symposium on Electromagnetic CompatibiIity, EMC 2002
PlaceChina
CityBeijing
Period21 - 24 May 2002

Abstract

Electrostatic Discharge (ESD) can cause serious problems in digital electronic devices. Indirect coupling through apertures on the metallic enclosure to the internal circuitries can also affect the performance of the devices. In this paper, we investigate experimentally the effect of the coupling field through apertures on the metallic enclosure.

Citation Format(s)

Experimental study of ESD effect on metallic enclosure. / Chan, K. H.; Fung, L. C.; Leung, S. W.

IEEE International Symposium on Electromagnetic Compatibility. Vol. 2002-January Institute of Electrical and Electronics Engineers Inc., 2002. p. 490-492 1177477.

Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)peer-review