Exceptional thermal stability of additively manufactured CoCrFeMnNi high-entropy alloy with cellular dislocation structures

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

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Author(s)

  • Yanfang Liu
  • Jie Ren
  • Jian Liu
  • Yang Cao
  • Wei Liu
  • Tianyi Li
  • Wen Chen

Detail(s)

Original languageEnglish
Article number145650
Journal / PublicationMaterials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
Volume885
Online published1 Sept 2023
Publication statusPublished - 3 Oct 2023

Abstract

CoCrFeMnNi high-entropy alloy (HEA) was additively manufactured (AM) by laser powder-bed fusion (L-PBF). The AM CoCrFeMnNi has prominent cellular dislocation structures with a small number of Mn-rich oxides. The thermal stability of the AM CoCrFeMnNi was investigated by isochronal annealing treatment at various temperatures from 400 to 1300 °C for 1 h. Microstructural analysis shows slow dislocation recovery, retarded recrystallization process, and precipitation of additional Cr-Mn based oxides during thermal annealing, resulting in exceptional thermal stability and retained high hardness at elevated temperatures. By thermodynamic calculations, a low stored energy of 1.31 MJ/m3 and a high activation energy of 353 kJ/mol for recrystallization were estimated for the AM CoCrFeMnNi. The exceptional thermal stability of the AM CoCrFeMnNi HEA is mechanistically attributed to the low crystallographic misorientations across the dislocation cell walls, sluggish atomic diffusion, and the pinning effects of the oxide nanoprecipitates. © 2023 Elsevier B.V.

Research Area(s)

  • Additive manufacturing, Cellular dislocation structure, High-entropy alloy, Precipitates, Thermal stability

Citation Format(s)

Exceptional thermal stability of additively manufactured CoCrFeMnNi high-entropy alloy with cellular dislocation structures. / Liu, Yanfang; Ren, Jie; Liu, Jian et al.
In: Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing, Vol. 885, 145650, 03.10.2023.

Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review