Evolution of texture and microstructure in pulsed electro-deposited Cu treated by Surface Mechanical Attrition Treatment (SMAT)

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

23 Scopus Citations
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Author(s)

  • Romain Blonde
  • Hoi-Lam Chan
  • Nathalie Allain-Bonasso
  • Bernard Bolle
  • Thierry Grosdidier

Detail(s)

Original languageEnglish
Journal / PublicationJournal of Alloys and Compounds
Volume504
Issue numberSUPPL. 1
Publication statusPublished - Aug 2010
Externally publishedYes

Abstract

This paper presents the microstructure and texture evolution in pulsed electro-deposited copper samples and the additional effect of the Surface Mechanical Attrition Treatment (SMAT), which were analyzed by means of electron backscattering and X-ray diffractions. A transition in the microstructure was observed as the thickness of the deposit increased: from randomly oriented equiaxed (3D) nanograins at the beginning of the deposition process towards elongated (2D) nanograins having a strong 〈1 1 0〉 fibre texture. Meanwhile, the SMAT treatment is shown to randomize the strong texture of the electrodeposits. © 2010 Elsevier B.V.

Research Area(s)

  • Coating materials, Nanostructured materials

Citation Format(s)

Evolution of texture and microstructure in pulsed electro-deposited Cu treated by Surface Mechanical Attrition Treatment (SMAT). / Blonde, Romain; Chan, Hoi-Lam; Allain-Bonasso, Nathalie; Bolle, Bernard; Grosdidier, Thierry; Lu, Jian.

In: Journal of Alloys and Compounds, Vol. 504, No. SUPPL. 1, 08.2010.

Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review