Evolution of texture and microstructure in pulsed electro-deposited Cu treated by Surface Mechanical Attrition Treatment (SMAT)
Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Author(s)
Detail(s)
Original language | English |
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Pages (from-to) | S410–S413 |
Journal / Publication | Journal of Alloys and Compounds |
Volume | 504 |
Issue number | SUPPL. 1 |
Online published | 15 May 2010 |
Publication status | Published - Aug 2010 |
Externally published | Yes |
Link(s)
Abstract
This paper presents the microstructure and texture evolution in pulsed electro-deposited copper samples and the additional effect of the Surface Mechanical Attrition Treatment (SMAT), which were analyzed by means of electron backscattering and X-ray diffractions. A transition in the microstructure was observed as the thickness of the deposit increased: from randomly oriented equiaxed (3D) nanograins at the beginning of the deposition process towards elongated (2D) nanograins having a strong 〈1 1 0〉 fibre texture. Meanwhile, the SMAT treatment is shown to randomize the strong texture of the electrodeposits. © 2010 Elsevier B.V.
Research Area(s)
- Coating materials, Nanostructured materials
Citation Format(s)
Evolution of texture and microstructure in pulsed electro-deposited Cu treated by Surface Mechanical Attrition Treatment (SMAT). / Blonde, Romain; Chan, Hoi-Lam; Allain-Bonasso, Nathalie et al.
In: Journal of Alloys and Compounds, Vol. 504, No. SUPPL. 1, 08.2010, p. S410–S413.Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review