Evolution of texture and microstructure in pulsed electro-deposited Cu treated by Surface Mechanical Attrition Treatment (SMAT)

This paper presents the microstructure and texture evolution in pulsed electro-deposited copper samples and the additional effect of the Surface Mechanical Attrition Treatment (SMAT), which were analyzed by means of electron backscattering and X-ray diffractions. A transition in the microstructure was observed as the thickness of the deposit increased: from randomly oriented equiaxed (3D) nanograins at the beginning of the deposition process towards elongated (2D) nanograins having a strong 〈1 1 0〉 fibre texture. Meanwhile, the SMAT treatment is shown to randomize the strong texture of the electrodeposits. © 2010 Elsevier B.V.