Abstract
The nano-indentation method has been developed to evaluate the mechanical properties of metal films. In this study an indentation loading curve is employed to determine the yield strength and hardening index of an Al film on a Si substrate. The result is compared with that measured by a uniaxial tensile test with an Al film deposited on an Al foil. The yield strength of the Al film can be determined according to the testing results of this compound material and it agrees reasonably with that evaluated by the nano-indentation method. In addition, X-ray diffraction measurements of the four point bending specimen is used to measure the stress-strain curve of Cu films on steel substrate. The samples are prepared by ion beam enhanced deposition and magnetron-sputtering deposition. The results show that the strength of Cu film depends on the deposition technology and is much higher than that of the bulk material.
| Original language | English |
|---|---|
| Pages (from-to) | 128-132 |
| Journal | Surface and Coatings Technology |
| Volume | 116-119 |
| DOIs | |
| Publication status | Published - Sept 1999 |
| Externally published | Yes |
| Event | Proceedings of the 1998 6th International Conference on Plasma Surface Engineering (PSE-98) - Garmisch-Partenkirchen, Ger Duration: 14 Sept 1998 → 18 Sept 1998 |
Research Keywords
- Hardening index
- Metal films
- Nano-indentation
- X-ray diffraction
- Yield strength
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