Etch-hole-assisted energy dispersion for enhancing quality factor in silicon bulk acoustic resonators

Cheng Tu; Joshua E.-Y. Lee

doi:10.1109/MEMSYS.2014.6765877

Etch-hole-assisted energy dispersion for enhancing quality factor in silicon bulk acoustic resonators

Cheng Tu^*
, Joshua E.-Y. Lee

^*Corresponding author for this work

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

2 Citations (Scopus)

Abstract

This paper empirically demonstrates how the quality factor (Q) of a width-extensional mode single-crystal silicon bulk-acoustic-resonator (SiBAR) can be enhanced by three times by strategic placement of holes on the structure. The holes serve to disperse the strain energy field concentrated primarily around the nodal lines, ultimately re-distributing strain energy away from the anchors. This in turn reduces anchor loss and thus enhances Q. These results agree well with our finite-element (FE) simulations. We envisage that the concepts reported herein can be extended to even higher performance resonators like piezoelectric aluminum nitride contour mode resonators. © 2014 IEEE.

Original language	English
Title of host publication	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Publisher	IEEE
Pages	1257-1260
ISBN (Print)	9781479935086
DOIs	https://doi.org/10.1109/MEMSYS.2014.6765877
Publication status	Published - 2014
Event	27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014 - San Francisco, United States Duration: 26 Jan 2014 → 30 Jan 2014 https://ieeexplore.ieee.org/xpl/conhome/6749560/proceeding

Publication series

Name
ISSN (Print)	1084-6999

Conference

Conference	27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014
Place	United States
City	San Francisco
Period	26/01/14 → 30/01/14
Internet address	https://ieeexplore.ieee.org/xpl/conhome/6749560/proceeding

Access Output

10.1109/MEMSYS.2014.6765877

Other Access Options

Check CityUHK Library

Permanent Link

Right click to copy link

Cite this

@inproceedings{b8e5b4beba4340a193a29e46acda9e3f,

title = "Etch-hole-assisted energy dispersion for enhancing quality factor in silicon bulk acoustic resonators",

abstract = "This paper empirically demonstrates how the quality factor (Q) of a width-extensional mode single-crystal silicon bulk-acoustic-resonator (SiBAR) can be enhanced by three times by strategic placement of holes on the structure. The holes serve to disperse the strain energy field concentrated primarily around the nodal lines, ultimately re-distributing strain energy away from the anchors. This in turn reduces anchor loss and thus enhances Q. These results agree well with our finite-element (FE) simulations. We envisage that the concepts reported herein can be extended to even higher performance resonators like piezoelectric aluminum nitride contour mode resonators. {\textcopyright} 2014 IEEE.",

author = "Cheng Tu and Lee, \{Joshua E.-Y.\}",

year = "2014",

doi = "10.1109/MEMSYS.2014.6765877",

language = "English",

isbn = "9781479935086",

publisher = "IEEE",

pages = "1257--1260",

booktitle = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

address = "United States",

note = "27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014 ; Conference date: 26-01-2014 Through 30-01-2014",

url = "https://ieeexplore.ieee.org/xpl/conhome/6749560/proceeding",

}

Tu, C & Lee, JE-Y 2014, Etch-hole-assisted energy dispersion for enhancing quality factor in silicon bulk acoustic resonators. in Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)., 6765877, IEEE, pp. 1257-1260, 27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014, San Francisco, California, United States, 26/01/14. https://doi.org/10.1109/MEMSYS.2014.6765877

Etch-hole-assisted energy dispersion for enhancing quality factor in silicon bulk acoustic resonators. / Tu, Cheng; Lee, Joshua E.-Y.
Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). IEEE, 2014. p. 1257-1260 6765877.

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

TY - GEN

T1 - Etch-hole-assisted energy dispersion for enhancing quality factor in silicon bulk acoustic resonators

AU - Tu, Cheng

AU - Lee, Joshua E.-Y.

PY - 2014

Y1 - 2014

N2 - This paper empirically demonstrates how the quality factor (Q) of a width-extensional mode single-crystal silicon bulk-acoustic-resonator (SiBAR) can be enhanced by three times by strategic placement of holes on the structure. The holes serve to disperse the strain energy field concentrated primarily around the nodal lines, ultimately re-distributing strain energy away from the anchors. This in turn reduces anchor loss and thus enhances Q. These results agree well with our finite-element (FE) simulations. We envisage that the concepts reported herein can be extended to even higher performance resonators like piezoelectric aluminum nitride contour mode resonators. © 2014 IEEE.

AB - This paper empirically demonstrates how the quality factor (Q) of a width-extensional mode single-crystal silicon bulk-acoustic-resonator (SiBAR) can be enhanced by three times by strategic placement of holes on the structure. The holes serve to disperse the strain energy field concentrated primarily around the nodal lines, ultimately re-distributing strain energy away from the anchors. This in turn reduces anchor loss and thus enhances Q. These results agree well with our finite-element (FE) simulations. We envisage that the concepts reported herein can be extended to even higher performance resonators like piezoelectric aluminum nitride contour mode resonators. © 2014 IEEE.

UR - https://www.scopus.com/pages/publications/84898945879

UR - https://www.scopus.com/pages/publications/84898945879#tab=impact

U2 - 10.1109/MEMSYS.2014.6765877

DO - 10.1109/MEMSYS.2014.6765877

M3 - RGC 32 - Refereed conference paper (with host publication)

SN - 9781479935086

SP - 1257

EP - 1260

BT - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

PB - IEEE

T2 - 27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014

Y2 - 26 January 2014 through 30 January 2014

ER -

Etch-hole-assisted energy dispersion for enhancing quality factor in silicon bulk acoustic resonators

Abstract

Publication series

Conference

Access Output

Other Access Options

Permanent Link

Other Files and Links

Fingerprint

Cite this