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Enhancement of hardness and thermal stability of W-doped Ni3Al thin films at elevated temperature

  • Chao Zhang
  • , Kai Feng*
  • , Zhuguo Li*
  • , Fenggui Lu
  • , Jian Huang
  • , Yixiong Wu
  • , Paul.K. Chu
  • *Corresponding author for this work

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Abstract

    Nanocrystalline (NC) Ni3Al thin films have poor mechanical properties at a high temperature and in order to improve the thermal performance, it is necessary to develop novel micro- or nanostructures that endow the coatings with both high thermal stability and hardness. In this work, Ni3Al thin films with different W concentrations up to 12.5 at% are deposited on Si/SiO2 substrates by magnetron sputtering and then vacuum-annealed at 500 °C and 700 °C. Addition of W to the nanostructured Ni3Al thin films leads to grain refinement and high thermal stability. The hardness (H) of the film with 12.5 at% W annealed at 700 °C increases by 355% compared to pure Ni3Al. X-ray diffraction and transmission electron microscopy reveal non-equilibrium phases such as the amorphous phase and supersaturation solid solution in the films annealed at 500 °C. After annealing at 700 °C, the α-W phase precipitated in the fine nanocrystalline state plays a crucial role in the high thermal stability of the nano-grains as well as enhanced hardness. The results suggest that these durable Ni-based coatings are suitable for applications at high temperature.
    Original languageEnglish
    Pages (from-to)575-583
    JournalMaterials and Design
    Volume111
    DOIs
    Publication statusPublished - 5 Dec 2016

    Research Keywords

    • Hardness
    • Nanocrystalline
    • Ni3Al
    • Thermal stability
    • W doped

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