Enhanced heat transfer performance with designed pin fin cold plate for 50 kW high power density converter

Lingxi Zhang; Ziyou Lim; Arie Nawawi; Yong Liu; Josep Pou; Rejeki Simanjorang

doi:10.1109/APEC.2019.8722001

Enhanced heat transfer performance with designed pin fin cold plate for 50 kW high power density converter

Lingxi Zhang
, Ziyou Lim
, Arie Nawawi
, Yong Liu
, Josep Pou
, Rejeki Simanjorang

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

Abstract

Cooling requirement is very stringent for power converters in aircraft due to high power density and high switching frequency. The total thermal loss rises as the power and switching frequency increase. This paper demonstrates a pin fin cold plate designed for a 60 kHz 50 kW/400 Hz three-phase two-level high power density converter (HPDC). Simulation results and experimental results indicate that the pin fin cold plate has lower thermal resistance (Rth) and requires lower pump power compared with the two-pipe cold plate. The Silicon Carbide (SiC) power module junction temperature is within the limitation when maximum power loss (3%) occurs on each module. Thermal interface material (TIM) is the weakest part with the lowest thermal conductivity in the heat transfer path. Therefore, Panasonic Graphite Sheet (PGS) is studied and applied with minimum 8.8% temperature decrease compared with thermal grease. © 2019 IEEE.

Original language	English
Title of host publication	34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019
Publisher	IEEE
Pages	1365-1369
Volume	2019-March
ISBN (Print)	9781538683309
DOIs	https://doi.org/10.1109/APEC.2019.8722001
Publication status	Published - 24 May 2019
Externally published	Yes
Event	34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019 - Anaheim, United States Duration: 17 Mar 2019 → 21 Mar 2019

Publication series

Name	Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
Volume	2019-March

Conference

Conference	34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019
Place	United States
City	Anaheim
Period	17/03/19 → 21/03/19

Bibliographical note

Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

Funding

ACKNOWLEDGMENT This work was conducted within the Rolls-Royce@NTU Corporate Lab with support from the National Research Foundation (NRF) Singapore under the Corp Lab@University Scheme.

Research Keywords

High power density converter
Panasonic Graphite Sheet (PGS)
Pin fin cold plate
Thermal interface material (TIM)

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10.1109/APEC.2019.8722001

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Zhang, L., Lim, Z., Nawawi, A., Liu, Y., Pou, J., & Simanjorang, R. (2019). Enhanced heat transfer performance with designed pin fin cold plate for 50 kW high power density converter. In 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019 (Vol. 2019-March, pp. 1365-1369). Article 8722001 (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC; Vol. 2019-March). IEEE. https://doi.org/10.1109/APEC.2019.8722001

Zhang, Lingxi ; Lim, Ziyou ; Nawawi, Arie et al. / Enhanced heat transfer performance with designed pin fin cold plate for 50 kW high power density converter. 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019. Vol. 2019-March IEEE, 2019. pp. 1365-1369 (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC).

@inproceedings{f5f40f2dc42e454196a824a8ec1d9fc7,

title = "Enhanced heat transfer performance with designed pin fin cold plate for 50 kW high power density converter",

abstract = "Cooling requirement is very stringent for power converters in aircraft due to high power density and high switching frequency. The total thermal loss rises as the power and switching frequency increase. This paper demonstrates a pin fin cold plate designed for a 60 kHz 50 kW/400 Hz three-phase two-level high power density converter (HPDC). Simulation results and experimental results indicate that the pin fin cold plate has lower thermal resistance (Rth) and requires lower pump power compared with the two-pipe cold plate. The Silicon Carbide (SiC) power module junction temperature is within the limitation when maximum power loss (3\%) occurs on each module. Thermal interface material (TIM) is the weakest part with the lowest thermal conductivity in the heat transfer path. Therefore, Panasonic Graphite Sheet (PGS) is studied and applied with minimum 8.8\% temperature decrease compared with thermal grease. {\textcopyright} 2019 IEEE.",

keywords = "High power density converter, Panasonic Graphite Sheet (PGS), Pin fin cold plate, Thermal interface material (TIM)",

author = "Lingxi Zhang and Ziyou Lim and Arie Nawawi and Yong Liu and Josep Pou and Rejeki Simanjorang",

note = "Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].; 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019 ; Conference date: 17-03-2019 Through 21-03-2019",

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doi = "10.1109/APEC.2019.8722001",

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Zhang, L, Lim, Z, Nawawi, A, Liu, Y, Pou, J & Simanjorang, R 2019, Enhanced heat transfer performance with designed pin fin cold plate for 50 kW high power density converter. in 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019. vol. 2019-March, 8722001, Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC, vol. 2019-March, IEEE, pp. 1365-1369, 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019, Anaheim, United States, 17/03/19. https://doi.org/10.1109/APEC.2019.8722001

Enhanced heat transfer performance with designed pin fin cold plate for 50 kW high power density converter. / Zhang, Lingxi; Lim, Ziyou; Nawawi, Arie et al.
34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019. Vol. 2019-March IEEE, 2019. p. 1365-1369 8722001 (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC; Vol. 2019-March).

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

TY - GEN

T1 - Enhanced heat transfer performance with designed pin fin cold plate for 50 kW high power density converter

AU - Zhang, Lingxi

AU - Lim, Ziyou

AU - Nawawi, Arie

AU - Liu, Yong

AU - Pou, Josep

AU - Simanjorang, Rejeki

N1 - Publication details (e.g. title, author(s), publication statuses and dates) are captured on an “AS IS” and “AS AVAILABLE” basis at the time of record harvesting from the data source. Suggestions for further amendments or supplementary information can be sent to [email protected].

PY - 2019/5/24

Y1 - 2019/5/24

N2 - Cooling requirement is very stringent for power converters in aircraft due to high power density and high switching frequency. The total thermal loss rises as the power and switching frequency increase. This paper demonstrates a pin fin cold plate designed for a 60 kHz 50 kW/400 Hz three-phase two-level high power density converter (HPDC). Simulation results and experimental results indicate that the pin fin cold plate has lower thermal resistance (Rth) and requires lower pump power compared with the two-pipe cold plate. The Silicon Carbide (SiC) power module junction temperature is within the limitation when maximum power loss (3%) occurs on each module. Thermal interface material (TIM) is the weakest part with the lowest thermal conductivity in the heat transfer path. Therefore, Panasonic Graphite Sheet (PGS) is studied and applied with minimum 8.8% temperature decrease compared with thermal grease. © 2019 IEEE.

AB - Cooling requirement is very stringent for power converters in aircraft due to high power density and high switching frequency. The total thermal loss rises as the power and switching frequency increase. This paper demonstrates a pin fin cold plate designed for a 60 kHz 50 kW/400 Hz three-phase two-level high power density converter (HPDC). Simulation results and experimental results indicate that the pin fin cold plate has lower thermal resistance (Rth) and requires lower pump power compared with the two-pipe cold plate. The Silicon Carbide (SiC) power module junction temperature is within the limitation when maximum power loss (3%) occurs on each module. Thermal interface material (TIM) is the weakest part with the lowest thermal conductivity in the heat transfer path. Therefore, Panasonic Graphite Sheet (PGS) is studied and applied with minimum 8.8% temperature decrease compared with thermal grease. © 2019 IEEE.

KW - High power density converter

KW - Panasonic Graphite Sheet (PGS)

KW - Pin fin cold plate

KW - Thermal interface material (TIM)

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U2 - 10.1109/APEC.2019.8722001

DO - 10.1109/APEC.2019.8722001

M3 - RGC 32 - Refereed conference paper (with host publication)

SN - 9781538683309

VL - 2019-March

T3 - Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

SP - 1365

EP - 1369

BT - 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019

PB - IEEE

T2 - 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019

Y2 - 17 March 2019 through 21 March 2019

ER -

Zhang L, Lim Z, Nawawi A, Liu Y, Pou J, Simanjorang R. Enhanced heat transfer performance with designed pin fin cold plate for 50 kW high power density converter. In 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019. Vol. 2019-March. IEEE. 2019. p. 1365-1369. 8722001. (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC). doi: 10.1109/APEC.2019.8722001

Enhanced heat transfer performance with designed pin fin cold plate for 50 kW high power density converter

Abstract

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Bibliographical note

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Research Keywords

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