Endoscopic Inspection of Solder Joint Integrity in Chip Scale Packages

Y.C. Chan; C.W. Tang; P.L. Tu

doi:10.1109/ECTC.2000.853215

Endoscopic Inspection of Solder Joint Integrity in Chip Scale Packages

Y.C. Chan, C.W. Tang, P.L. Tu

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

5 Citations (Scopus)

Abstract

This paper reports, for the first time, the use of endoscopy for the nondestructive examination of solder joint integrity in chip scale packages (CSP) such as flip chip on flex (FCF). Borrowed from the medical instrument technology, the endoscope is used to examine visually the inside of 'an organ. This concept has now been developed and refined by ERSA and KURTZ, and led to an ERSASCOPE inspection system coupled with sophisticated but user-friendly software for data and image analysis. We have successfully used this endoscopic method to evaluate the solder joint integrity in CSP such as cold joints, standoff height measurements, and probing of inner rows of ball joint integrity. Since this new instrument has only been introduced very recently, we will also report the latest results for obtaining the optimal examination of solder joint integrity achievable in conjunction with ERSA and KURTZ#. By analyzing the many varieties of CSP samples from our EPA Center's
clients, we have witnessed the tremendous power of endoscopy when applied to the nondestructive examination of CSP's solder joints, and found this method of immense use to the quality assessment of miniaturized electronic packages. We will also give a critical review of this inspection method when applied to CSP.

Original language	English
Title of host publication	2000 PROCEEDINGS - 50th ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE
Pages	569-575
DOIs	https://doi.org/10.1109/ECTC.2000.853215
Publication status	Published - May 2000
Event	50th Electronic Components and Technology Conference (ECTC 2000) - Las Vegas, United States Duration: 21 May 2000 → 24 May 2000

Publication series

Name	Proceedings - Electronic Components and Technology Conference
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISSN (Print)	0569-5503

Conference

Conference	50th Electronic Components and Technology Conference (ECTC 2000)
Place	United States
City	Las Vegas
Period	21/05/00 → 24/05/00

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10.1109/ECTC.2000.853215

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title = "Endoscopic Inspection of Solder Joint Integrity in Chip Scale Packages",

abstract = "This paper reports, for the first time, the use of endoscopy for the nondestructive examination of solder joint integrity in chip scale packages (CSP) such as flip chip on flex (FCF). Borrowed from the medical instrument technology, the endoscope is used to examine visually the inside of 'an organ. This concept has now been developed and refined by ERSA and KURTZ, and led to an ERSASCOPE inspection system coupled with sophisticated but user-friendly software for data and image analysis. We have successfully used this endoscopic method to evaluate the solder joint integrity in CSP such as cold joints, standoff height measurements, and probing of inner rows of ball joint integrity. Since this new instrument has only been introduced very recently, we will also report the latest results for obtaining the optimal examination of solder joint integrity achievable in conjunction with ERSA and KURTZ#. By analyzing the many varieties of CSP samples from our EPA Center'sclients, we have witnessed the tremendous power of endoscopy when applied to the nondestructive examination of CSP's solder joints, and found this method of immense use to the quality assessment of miniaturized electronic packages. We will also give a critical review of this inspection method when applied to CSP.",

author = "Y.C. Chan and C.W. Tang and P.L. Tu",

year = "2000",

month = may,

doi = "10.1109/ECTC.2000.853215",

language = "English",

isbn = "0-7803-5908-9",

series = "Proceedings - Electronic Components and Technology Conference",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "569--575",

booktitle = "2000 PROCEEDINGS - 50th ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE",

note = "50th Electronic Components and Technology Conference (ECTC 2000) ; Conference date: 21-05-2000 Through 24-05-2000",

}

Chan, YC, Tang, CW & Tu, PL 2000, Endoscopic Inspection of Solder Joint Integrity in Chip Scale Packages. in 2000 PROCEEDINGS - 50th ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE. Proceedings - Electronic Components and Technology Conference, pp. 569-575, 50th Electronic Components and Technology Conference (ECTC 2000), Las Vegas, Nevada, United States, 21/05/00. https://doi.org/10.1109/ECTC.2000.853215

Endoscopic Inspection of Solder Joint Integrity in Chip Scale Packages. / Chan, Y.C.; Tang, C.W.; Tu, P.L.
2000 PROCEEDINGS - 50th ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE. 2000. p. 569-575 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

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N2 - This paper reports, for the first time, the use of endoscopy for the nondestructive examination of solder joint integrity in chip scale packages (CSP) such as flip chip on flex (FCF). Borrowed from the medical instrument technology, the endoscope is used to examine visually the inside of 'an organ. This concept has now been developed and refined by ERSA and KURTZ, and led to an ERSASCOPE inspection system coupled with sophisticated but user-friendly software for data and image analysis. We have successfully used this endoscopic method to evaluate the solder joint integrity in CSP such as cold joints, standoff height measurements, and probing of inner rows of ball joint integrity. Since this new instrument has only been introduced very recently, we will also report the latest results for obtaining the optimal examination of solder joint integrity achievable in conjunction with ERSA and KURTZ#. By analyzing the many varieties of CSP samples from our EPA Center'sclients, we have witnessed the tremendous power of endoscopy when applied to the nondestructive examination of CSP's solder joints, and found this method of immense use to the quality assessment of miniaturized electronic packages. We will also give a critical review of this inspection method when applied to CSP.

AB - This paper reports, for the first time, the use of endoscopy for the nondestructive examination of solder joint integrity in chip scale packages (CSP) such as flip chip on flex (FCF). Borrowed from the medical instrument technology, the endoscope is used to examine visually the inside of 'an organ. This concept has now been developed and refined by ERSA and KURTZ, and led to an ERSASCOPE inspection system coupled with sophisticated but user-friendly software for data and image analysis. We have successfully used this endoscopic method to evaluate the solder joint integrity in CSP such as cold joints, standoff height measurements, and probing of inner rows of ball joint integrity. Since this new instrument has only been introduced very recently, we will also report the latest results for obtaining the optimal examination of solder joint integrity achievable in conjunction with ERSA and KURTZ#. By analyzing the many varieties of CSP samples from our EPA Center'sclients, we have witnessed the tremendous power of endoscopy when applied to the nondestructive examination of CSP's solder joints, and found this method of immense use to the quality assessment of miniaturized electronic packages. We will also give a critical review of this inspection method when applied to CSP.

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Endoscopic Inspection of Solder Joint Integrity in Chip Scale Packages

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