Encapsulation Technologies for Electronic Applications

The use of electronic has become intimately intertwined with human lives. From laptops and mobile phones to medical instruments and aircraft control units, electronic devices are used in most products today and in increasingly varying environments. The dominant trend is toward smaller, lighter, and faster electronic devices. Electronic packaging and plastic encapsulation play a significant role in this trend. With advances in electronic packaging including three-dimensional packaging (or die-stacking), wafer – level packaging, environmentally friendly or “green” encapsulant materials, and extreme high- and low-temperature electronics, a book on encapsulation technologies used in electronic applications has become essential.This new book, “Encapsulation Technologies for Electronic Applications”, describes the fundamentals of plastic encapsulation, discusses advances in encapsulation materials and technologies, and explore the intersection of Emerging technologies such as nanotechnology and biotechnology with encapsulant materials. This book is essential reading for the electronics production industry, providing guidance on the selection of encapsulants and extensive, coverage of defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. The main emphasis of this book is on the encapsulation of microelectronics; however, the encapsulation of connectors and transformers is also addressed.